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Methods of filling trenches using high-density plasma deposition (HDP)

Methods of filling trenches using high-density plasma deposition (HDP)

by Cha, Yong-Won, Na, Kyu-tae
Year of Publication 06.10.2009

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Patent

Methods of forming spin-on-glass insulating layers in semiconductor devices and associated semiconductor device

Methods of forming spin-on-glass insulating layers in semiconductor devices and associated semiconductor device

by Goo, Juseon, Hong, Eunkee, Kim, Hong-Gun, Na, Kyu-Tae
Year of Publication 08.09.2009

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Patent

Methods of filling trenches using high-density plasma deposition (HDP)

Methods of filling trenches using high-density plasma deposition (HDP)

by Cha, Yong-Won, Na, Kyu-tae
Year of Publication 06.06.2006

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Patent

Methods of forming semiconductor devices having multilayer isolation structures

Methods of forming semiconductor devices having multilayer isolation structures

by Kim, Hong-Gun, Hong, Eunkee, Na, Kyu-Tae
Year of Publication 19.05.2009

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Patent

Isolation layer structure, method of forming the same and method of manufacturing a semiconductor device including the same

Isolation layer structure, method of forming the same and method of manufacturing a semiconductor device including the same

by Kim, Ju-Wan, Na, Kyu-Tae, Kim, Min, Park, Seung-Bae, Kim, Il-Woo, Kwak, Dae-Young
Year of Publication 07.08.2012

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Patent

Method of removing an oxide and method of filling a trench using the same

Method of removing an oxide and method of filling a trench using the same

by Lee, Seung-Heon, Na, Kyu-Tae, Kim, Ju-Wan, Kim, Taek-Jung
Year of Publication 29.06.2010

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Patent

Method of forming isolation layer structure and method of manufacturing a semiconductor device including the same

Method of forming isolation layer structure and method of manufacturing a semiconductor device including the same

by Kim, Ju-Wan, Na, Kyu-Tae, Kim, Min, Park, Seung-Bae, Kim, Il-Woo, Kwak, Dae-Young
Year of Publication 13.09.2011

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Patent

Method of forming a trench isolation layer and method of manufacturing a non-volatile memory device using the same

Method of forming a trench isolation layer and method of manufacturing a non-volatile memory device using the same

by Choi, Jong-Wan, Kim, Hong-Gun, Na, Kyu-Tae, Hong, Eunkee
Year of Publication 13.10.2009

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Patent

Method of forming a thin layer and method of manufacturing a non-volatile semiconductor device using the same

Method of forming a thin layer and method of manufacturing a non-volatile semiconductor device using the same

by Joo, Kyong-Hee, Cha, Yong-Won, Lim, Seung-Hyun, Yeo, In-Seok, Na, Kyu-Tae
Year of Publication 14.07.2009

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Patent

Method for forming a silicon oxide layer using spin-on glass

Method for forming a silicon oxide layer using spin-on glass

by Goo, Ju-Seon, Hong, Eun-Kee, Kim, Hong-Gun, Na, Kyu-Tae
Year of Publication 14.04.2009

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Patent

Method of forming carbon polymer film using plasma CVD

Method of forming carbon polymer film using plasma CVD

by Morisada, Yoshinori, Goundar, Kamal Kishore, Yamaguchi, Masashi, Matsuki, Nobuo, Na, Kyu Tae, Baek, Eun Kyung
Year of Publication 12.08.2008

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Patent

Methods of filling gaps by deposition on materials having different deposition rates

Methods of filling gaps by deposition on materials having different deposition rates

by Kim, Hong-gun, Na, Kyu-tae, Hong, Eun-Kee, Goo, Ju-Seon
Year of Publication 15.04.2008

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Patent

Methods of forming trench isolation layers using high density plasma chemical vapor deposition

Methods of forming trench isolation layers using high density plasma chemical vapor deposition

by Cha, Yong-Won, Na, Kyu-Tae, Choi, Yong-Soon, Hong, Eunkee, Goo, Ju-Seon
Year of Publication 19.02.2008

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Patent

Integrated circuit devices and methods of forming the same that have a low dielectric insulating interlayer between conductive structures

Integrated circuit devices and methods of forming the same that have a low dielectric insulating interlayer between conductive structures

by Na, Kyu-Tae, Baek, Eun-Kyung, Park, Joon-Sang
Year of Publication 02.09.2004

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Patent

Method for forming a silicon oxide layer using spin-on glass

Method for forming a silicon oxide layer using spin-on glass

by Goo, Ju-Seon, Hong, Eun-Kee, Kim, Hong-Gun, Na, Kyu-Tae
Year of Publication 20.03.2007

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Patent

A novel NF/sub 3/-HDP-CVD process for STI-filling in sub-90 nm DRAM and beyond

A novel NF/sub 3/-HDP-CVD process for STI-filling in sub-90 nm DRAM and beyond

by Yong-Won Cha, Sang-Ho Rha, Won-Jin Kim, Kyu-Tae Na, U-In Chung, Joo-Tae Moon
Published in 2003 Symposium on VLSI Technology. Digest of Technical Papers (IEEE Cat. No.03CH37407) (2003)

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Conference Proceeding

Methods of filling gaps by deposition on materials having different deposition rates

Methods of filling gaps by deposition on materials having different deposition rates

by Na, Kyu-Tae, Kim, Hong-Gun, Hong, Eun-Kee, Goo, Ju-Seon
Year of Publication 29.07.2004

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Patent

Methods of forming isolation regions for FinFET semiconductor devices

Methods of forming isolation regions for FinFET semiconductor devices

by NA KYU TAE
Year of Publication 18.03.2014

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Patent

Methods of forming a metal silicide layer for semiconductor devices

Methods of forming a metal silicide layer for semiconductor devices

by KIM MIN, NA KYU-TAE, PARK JE-HYEON, KIM HYUN-YOUNG, HUR WON-GOO
Year of Publication 22.10.2013

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Patent

Methods of filling trenches using high-density plasma deposition (HDP)

Methods of filling trenches using high-density plasma deposition (HDP)

by CHA YONG-WON, NA KYU-TAE
Year of Publication 06.10.2009

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Patent