Search Results - "Na, Duk Ju" :: K.UTB vyhledávací portál | TBU Library Retrieval Portal

TSV MEOL (Mid End of Line) and packaging technology of mobile 3D-IC stacking

TSV MEOL (Mid End of Line) and packaging technology of mobile 3D-IC stacking

by Duk Ju Na, Kyaw Oo Aung, Won Kyung Choi, Kida, Tsuyoshi, Ochiai, Toshihiko, Hashimoto, Tomoaki, Kimura, Michitaka, Kata, Keiichirou, Seung Wook Yoon, Yong, Andy Chang Bum
Published in 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) (01.05.2014)

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Conference Proceeding

2.5D/3D TSV processes development and assembly/packaging technology

2.5D/3D TSV processes development and assembly/packaging technology

by Seung Wook Yoon, Duk Ju Na, Won Kyoung Choi, Keon Taek Kang, Chang Bum Yong, Young Chul Kim, Marimuthu, P. C.
Published in 2011 IEEE 13th Electronics Packaging Technology Conference (01.12.2011)

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Conference Proceeding

Semiconductor device and method of forming conductive vias by direct via reveal with organic passivation

Semiconductor device and method of forming conductive vias by direct via reveal with organic passivation

by Chia, Lai Yee, Na, Duk Ju, Zhao, Xing
Year of Publication 04.02.2020

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Patent

Semiconductor device and method of forming conductive vias using backside via reveal and selective passivation

Semiconductor device and method of forming conductive vias using backside via reveal and selective passivation

by Marimuthu Pandi C, Yong Chang Beom, Na Duk Ju
Year of Publication 09.01.2018

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Patent

Semiconductor Device and Method of Forming Conductive Vias by Direct Via Reveal with Organic Passivation

Semiconductor Device and Method of Forming Conductive Vias by Direct Via Reveal with Organic Passivation

by Zhao Xing, Chia Lai Yee, Na Duk Ju
Year of Publication 21.12.2017

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Patent

Semiconductor device and method of forming conductive vias by direct via reveal with organic passivation

Semiconductor device and method of forming conductive vias by direct via reveal with organic passivation

by Zhao Xing, Chia Lai Yee, Na Duk Ju
Year of Publication 19.09.2017

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Patent

Semiconductor device and method of forming conductive vias by backside via reveal with CMP

Semiconductor device and method of forming conductive vias by backside via reveal with CMP

by Tan, Siew Joo, Na, Duk Ju, Marimuthu, Pandi C, Zhao, Xing
Year of Publication 30.10.2018

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Patent

Semiconductor device and method of wafer thinning involving edge trimming and CMP

Semiconductor device and method of wafer thinning involving edge trimming and CMP

by Zhao Xing, Chockanathan Vinoth Kanna, Yong Chang Bum, Na Duk Ju
Year of Publication 08.08.2017

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Patent

SEMICONDUCTOR DEVICE AND METHOD OF FORMING ADHESIVE LAYER OVER INSULATING LAYER FOR BONDING CARRIER TO MIXED SURFACES OF SEMICONDUCTOR DIE AND ENCAPSULANT

SEMICONDUCTOR DEVICE AND METHOD OF FORMING ADHESIVE LAYER OVER INSULATING LAYER FOR BONDING CARRIER TO MIXED SURFACES OF SEMICONDUCTOR DIE AND ENCAPSULANT

by NA DUK JU, CHIA LAI YEE
Year of Publication 03.12.2015

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Patent

Semiconductor device and method of forming adhesive layer over insulating layer for bonding carrier to mixed surfaces of semiconductor die and encapsulant

Semiconductor device and method of forming adhesive layer over insulating layer for bonding carrier to mixed surfaces of semiconductor die and encapsulant

by NA DUK JU, CHIA LAI YEE
Year of Publication 10.11.2015

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Patent

Semiconductor device and method of forming guard ring around conductive TSV through semiconductor wafer

Semiconductor device and method of forming guard ring around conductive TSV through semiconductor wafer

by NA DUK JU, CHIA LAI YEE, YONG CHANG BEOM
Year of Publication 09.02.2016

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Patent

Semiconductor Device and Method of Forming Conductive Vias by Direct Via Reveal with Organic Passivation

Semiconductor Device and Method of Forming Conductive Vias by Direct Via Reveal with Organic Passivation

by ZHAO XING, NA DUK JU, CHIA LAI YEE
Year of Publication 31.12.2015

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Patent

Semiconductor Device and Method of Forming Conductive Vias by Backside Via Reveal with CMP

Semiconductor Device and Method of Forming Conductive Vias by Backside Via Reveal with CMP

by ZHAO XING, MARIMUTHU PANDI C, TAN SIEW JOO, NA DUK JU
Year of Publication 31.12.2015

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Patent

Semiconductor device and method of forming through-silicon-via with sacrificial layer

Semiconductor device and method of forming through-silicon-via with sacrificial layer

by NA DUK JU, YONG CHANG BEOM, TAN CALVERT
Year of Publication 07.07.2015

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Patent

Semiconductor Device and Method of Wafer Thinning Involving Edge Trimming and CMP

Semiconductor Device and Method of Wafer Thinning Involving Edge Trimming and CMP

by ZHAO XING, NA DUK JU, YONG CHANG BUM, CHOCKANATHAN VINOTH KANNA
Year of Publication 25.06.2015

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Patent

Semiconductor Device and Method of Forming Conductive Vias Using Backside Via Reveal and Selective Passivation

Semiconductor Device and Method of Forming Conductive Vias Using Backside Via Reveal and Selective Passivation

by MARIMUTHU PANDI C, NA DUK JU, YONG CHANG BEOM
Year of Publication 09.10.2014

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Patent

Semiconductor Device and Method of Forming Through-Silicon-Via with Sacrificial Layer

Semiconductor Device and Method of Forming Through-Silicon-Via with Sacrificial Layer

by NA DUK JU, YONG CHANG BEOM, TAN CALVERT
Year of Publication 17.07.2014

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Patent

Integrated circuit through-substrate via system with a buffer layer and method of manufacture thereof

Integrated circuit through-substrate via system with a buffer layer and method of manufacture thereof

by ZHAO XING, JI LING, AUNG KYAW OO, NA DUK JU, YONG CHANG BUM
Year of Publication 08.03.2016

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Patent

Semiconductor Device and Method of Forming Guard Ring Around Conductive TSV Through Semiconductor Wafer

Semiconductor Device and Method of Forming Guard Ring Around Conductive TSV Through Semiconductor Wafer

by NA DUK JU, CHIA LAI YEE, YONG CHANG BEOM
Year of Publication 14.11.2013

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Patent

Semiconductor device and method of forming guard ring around conductive TSV through semiconductor wafer

Semiconductor device and method of forming guard ring around conductive TSV through semiconductor wafer

by NA DUK JU, CHIA LAI YEE, YONG CHANG BEOM
Year of Publication 15.10.2013

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Patent