Mixed Assembly of Lead-free Solder Joint: A Short Review
Said, Rita Mohd, Salleh, Mohd Arif Anuar Mohd, Ramli, Mohd Izrul Izwan, Saud, Norainiza, Somidin, Flora, Razak, Nurul Razliana Abdul, Ismail, Anis Nadhirah
Published in Journal of physics. Conference series (01.01.2022)
Published in Journal of physics. Conference series (01.01.2022)
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Journal Article
Transient liquid phase bonding for solder-a short review
Saud, Norainiza, Said, Rita Mohd
Published in IOP conference series. Materials Science and Engineering (01.12.2019)
Published in IOP conference series. Materials Science and Engineering (01.12.2019)
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Journal Article
Performance of Sn-3.0Ag-0.5Cu Composite Solder with Kaolin Geopolymer Ceramic Reinforcement on Microstructure and Mechanical Properties under Isothermal Ageing
Zaimi, Nur Syahirah Mohamad, Salleh, Mohd Arif Anuar Mohd, Sandu, Andrei Victor, Abdullah, Mohd Mustafa Al Bakri, Saud, Norainiza, Rahim, Shayfull Zamree Abd, Vizureanu, Petrica, Said, Rita Mohd, Ramli, Mohd Izrul Izwan
Published in Materials (07.02.2021)
Published in Materials (07.02.2021)
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Journal Article
Influence of 1.5 wt.% Bi on the Microstructure, Hardness, and Shear Strength of Sn-0.7Cu Solder Joints after Isothermal Annealing
Ramli, Mohd Izrul Izwan, Salleh, Mohd Arif Anuar Mohd, Sandu, Andrei Victor, Amli, Siti Farahnabilah Muhd, Said, Rita Mohd, Saud, Norainiza, Abdullah, Mohd Mustafa Al Bakri, Vizureanu, Petrica, Rylski, Adam, Chaiprapa, Jitrin, Nabialek, Marcin
Published in Materials (07.09.2021)
Published in Materials (07.09.2021)
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Journal Article
Enhanced thermal and microstructure properties of Sn-1.0Ag-0.7Cu based lead-free solder with Titanium Oxide addition
Said, Rita Mohd, Saud, Norainiza, Nasir, Norhayanti Mohd, Salleh, Mohd Arif Anuar Mohd, Derman, Mohd Nazree, Ramli, Mohd Izrul Izwan
Published in IOP conference series. Materials Science and Engineering (01.12.2019)
Published in IOP conference series. Materials Science and Engineering (01.12.2019)
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Journal Article
Growth Kinetic of Sn-0.7Cu-0.05Ni Solder Paste Subjected to Isothermal Aging
Ramli, Mohd Izrul Izwan, Saud, Norainiza, Said, Rita Mohd, Mohd Salleh, Mohd Arif Anuar
Published in Solid state phenomena (27.08.2018)
Published in Solid state phenomena (27.08.2018)
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Journal Article
OPTIMIZATION OF HOT AIR SOLDER LEVELING (HASL) MACHINE FOR A ROBUST SURFACE FINISH IN SOLDERING APPLICATIONS
RAMLI, Mohd Izrul Izwan, MUHD AMLI, Siti Farahnabilah, SAUD, Norainiza, CHE HALIN, Dewi Suriyani, MD FAUZI, Nur Akrimi Maswa
Published in European Journal of Materials Science and Engineering (Online) (20.03.2023)
Published in European Journal of Materials Science and Engineering (Online) (20.03.2023)
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Journal Article
The Effect of Thermal Annealing on the Microstructure and Mechanical Properties of Sn-0.7Cu-xZn Solder Joint
Ramli, Mohd Izrul Izwan, Salleh, Mohd Arif Anuar Mohd, Said, Rita Mohd, Abdullah, Mohd Mustafa Al Bakri, Halin, Dewi Suriyani Che, Saud, Norainiza, Nabiałek, Marcin
Published in Metals (Basel ) (01.03.2021)
Published in Metals (Basel ) (01.03.2021)
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Journal Article
Influence of Non-Metallic Particles Addition on Wettability, Intermetallic Compound Formation and Microhardness of Sn-0.7Cu Lead Free Solder Paste
Mohd Salleh, Mohd Arif Anuar, Al Bakri, A.M. Mustafa, Saud, Norainiza, Said, Rita Mohd, Zaimi, N.S. Mohamad
Published in Solid state phenomena (27.08.2018)
Published in Solid state phenomena (27.08.2018)
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Journal Article
Physical properties of Sn-3.0Ag-0.5Cu lead-free solder with the additional of SiC particles
Mahim, Zawawi, Salleh, Mohd Arif Anuar Mohd, Saud, Norainiza, Razak, Nurul Razliana Abdul, Yee, Khor Chu, Ahmad, Romisuhani, Ramli, Muhammad Mahyiddin
Published in IOP conference series. Materials Science and Engineering (01.12.2019)
Published in IOP conference series. Materials Science and Engineering (01.12.2019)
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Journal Article
Influence of Bismuth in Sn-Based Lead-Free Solder – A Short Review
Razak, Nurul Razliana Abdul, Mohd Salleh, Mohd Arif Anuar, Saud, Norainiza, Said, Rita Mohd, Ramli, Mohd Izrul Izwan
Published in Solid state phenomena (01.04.2018)
Published in Solid state phenomena (01.04.2018)
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Journal Article
Solidification Behavior of Sn Cu Based Peritectic Alloys: A Short Review
Saud, Norainiza, Mohd Salleh, Mohd Arif Anuar, Said, Rita Mohd, Ramli, Mohd Izrul Izwan, Sandu, Andrei Victor
Published in Solid state phenomena (01.04.2018)
Published in Solid state phenomena (01.04.2018)
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Journal Article