Search Results - "NONAKA TOSHIHISA" :: K.UTB vyhledávací portál

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Resin composition, resin sheet, and production method for semiconductor device

by MATSUMURA KAZUYUKI, NONAKA TOSHIHISA, SHIMBA YOICHI
Year of Publication 03.02.2016

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HIGH DIELECTRIC CONSTANT PASTE COMPOSITION AND DIELECTRIC COMPOSITION USING THE SAME

by NONAKA, Toshihisa, HARA, Yoshitake, MIZUGUCHI, Tsukuru, SHIMBA, Yoichi
Year of Publication 16.08.2017

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PHOTOSENSITIVE ADHESIVE COMPOSITION, PHOTOSENSITIVE ADHESIVE SHEET, AND SEMICONDUCTOR DEVICES USING SAME

by NONAKA, Toshihisa, SHIMADA, Akira, TACHIBANA, Yasuko, NIWA, Hiroyuki
Year of Publication 12.07.2017

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Adhesive composition, adhesive sheet, and semiconductor device using the adhesive composition or the adhesive sheet

by SHINBA YOICHI, NONAKA TOSHIHISA, SHIMADA AKIRA
Year of Publication 22.07.2015

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RESIN COMPOSITION, RESIN COMPOSITION SHEET, SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

by FUJIMARU, KOICHI, SHIMBA, YOICHI, NONAKA, TOSHIHISA
Year of Publication 01.07.2015

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Process for producing adhesive sheet having adhesive layer divided into individual pieces, process for producing wiring substrate using adhesive sheet, process for producing semiconductor device, and apparatus for producing adhesive sheet

by NIWA HIROYUKI, KATAYAMA MASAYA, NONAKA TOSHIHISA
Year of Publication 17.06.2015

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High thermal conductive adhesive film for Cu and Al plate adhesion in power eectronics package

by Nonaka, Toshihisa, Shimada, Akira, Aoki, Koichi, Asahi, Noboru
Published in 2013 IEEE 63rd Electronic Components and Technology Conference (01.05.2013)

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Conference Proceeding

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PROCESS FOR PRODUCING ADHESIVE SHEET HAVING SINGULATED ADHESIVE LAYER, PROCESS FOR PRODUCING WIRING SUBSTRATE USING THE ADHESIVE SHEET, METHOD OF MANUFACTURING SEMICONDUCTOR EQUIPMENT, AND EQUIPMENT FOR PRODUCING ADHESIVE SHEET

by NIWA HIROYUKI, KATAYAMA MASAYA, NONAKA TOSHIHISA
Year of Publication 23.04.2015

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Patent

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ADHESIVE SHEET FOR PRODUCTION OF SEMICONDUCTOR DEVICE HAVING BUMP ELECTRODES AND PRODUCTION METHOD FOR SEMICONDUCTOR DEVICE

by FUJIMARU, KOICHI, MATSUMURA, KAZUYUKI, NONAKA, TOSHIHISA
Year of Publication 08.04.2015

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PROCESS FOR PRODUCTION OF CORE-SHELL PARTICLES, CORE-SHELL PARTICLES, AND PASTE COMPOSITION AND SHEET COMPOSITION WHICH CONTAIN SAME

by SHINBA, YOICHI, NIIZEKI SHOICHI, NONAKA, TOSHIHISA
Year of Publication 18.03.2015

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ADHESIVE SHEET FOR PRODUCTION OF SEMICONDUCTOR DEVICE WITH BUMP ELECTRODE, AND METHOD FOR PRODUCTION OF SEMICONDUCTOR DEVICE

by MATSUMURA KAZUYUKI, NONAKA TOSHIHISA, FUJIMARU KOICHI
Year of Publication 12.03.2015

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TWI756318B

by FUJIMOTO, DAISUKE, SUZUKI, NAOYA, KASAHARA, AYA, NONAKA, TOSHIHISA
Year of Publication 01.03.2022

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Patent

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Fine-pitch hybrid bonding with Cu/Sn microbumps and adhesive for high density 3D integration

by Ohyama, Masaki, Mizuno, Jun, Shoji, Shuichi, Nimura, Masatsugu, Nonaka, Toshihisa, Shinba, Yoichi, Shigetou, Akitsu
Published in 2014 International Conference on Electronics Packaging (ICEP) (01.04.2014)

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Conference Proceeding