Search Results - "NISHIYAMA TEPPEI" :: K.UTB vyhledávací portál

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BOND PLY, CIRCUIT BOARD AND STRIP LINE USING THE SAME

by NISHIYAMA TEPPEI
Year of Publication 17.10.2022

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BOND PLY CIRCUIT BOARD USING THIS AND STRIP LINE

by NISHIYAMA TEPPEI
Year of Publication 07.10.2022

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METHOD FOR PRODUCING POLYIMIDE FILM AND METHOD FOR PRODUCING METAL CLAD LAMINATE

by NISHIYAMA TEPPEI
Year of Publication 07.04.2021

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METHOD FOR MANUFACTURING METAL-CLAD LAMINATED SHEET

by NISHIYAMA TEPPEI, ANDO TOMONORI
Year of Publication 25.03.2024

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MULTILAYER FILM METAL-CLAD LAMINATE AND CIRCUIT BOARD

by NISHIYAMA TEPPEI, KITTAKA NAOKI
Year of Publication 06.10.2023

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DISPERSION COMPOSITION, FLUORORESIN FILM, METAL-CLAD LAMINATED BOARD, AND METHOD FOR PRODUCING SAME

by ANDO Tomonori, NISHIYAMA Teppei
Year of Publication 05.10.2023

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MULTILAYER FILM, METAL-CLAD LAMINATE AND CIRCUIT BOARD

by NISHIYAMA TEPPEI, KITTAKA NAOKI
Year of Publication 04.10.2023

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METAL-CLAD LAMINATED BOARD AND METHOD FOR PRODUCING SAME

by ANDO Tomonori, NISHIYAMA Teppei
Year of Publication 05.10.2023

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CIRCUIT BOARD

by NISHIYAMA TEPPEI, ANDO TOMONORI
Year of Publication 07.10.2022

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CIRCUIT BOARD

by NISHIYAMA TEPPEI, ANDO TOMONORI
Year of Publication 05.10.2022

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Patent

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RESIN FILM, METAL-CLAD LAMINATE AND CIRCUIT BOARD

by NISHIYAMA TEPPEI, NAGAI ANNA
Year of Publication 06.07.2022

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Patent

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RESIN FILM FOR SENSOR, SENSOR HAVING THE SAME, AND RESIN COMPOSITION FOR FILM FORMATION OF SENSOR

by NISHIYAMA TEPPEI, KIKUCHI IORI
Year of Publication 16.09.2021

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METAL-CLAD LAMINATE AND CIRCUIT BOARD

by NISHIYAMA TEPPEI, ANDO TOMONORI, SANEMORI EIJI
Year of Publication 16.08.2024

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Patent

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CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

by NISHIYAMA TEPPEI, HIRAISHI KATSUFUMI
Year of Publication 30.04.2021

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Patent

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MANUFACTURING METHOD FOR METAL CLAD LAMINATE

by NISHIYAMA TEPPEI, ANDO TOMONORI, SANEMORI EIJI
Year of Publication 01.05.2024

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DISPERSION COMPOSITION, METHOD FOR PRODUCING THE SAME, METHOD FOR PRODUCING FLUORINE-BASED RESIN FILM, AND METHOD FOR MANUFACTURING METAL-CLAD LAMINATE

by NISHIYAMA TEPPEI, ASADA KOJI, ANDO TOMONORI
Year of Publication 11.04.2023

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RESIN FILM, LAMINATE, COVER LAY FILM, COPPER FOIL WITH RESIN, METAL-CLAD LAMINATE, CIRCUIT BOARD AND MULTILAYER CIRCUIT BOARD

by NISHIYAMA TEPPEI, HIRAISHI KATSUFUMI, SUDO YOSHIKI
Year of Publication 14.10.2022

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RESIN FILM LAMINATE COVERLAY FILM COPPER FOIL WITH RESIN METAL-CLAD LAMINATE PLATE CIRCUIT BOARD AND MULTILAYER CIRCUIT BOARD

by NISHIYAMA TEPPEI, HIRAISHI KATSUFUMI, SUTO YOSHIKI
Year of Publication 11.10.2022

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METHOD FOR PRODUCING POLYIMIDE

by NISHIYAMA TEPPEI, HIRAISHI KATSUFUMI, YAMADA HIROAKI, SUDO YOSHIKI, KAKIZAKA KOTA
Year of Publication 11.01.2024

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METAL-CLAD LAMINATE PLATE, CIRCUIT BOARD, ELECTRONIC DEVICE AND ELECTRONIC APPARATUS

by NISHIYAMA TEPPEI, KANEKO KAZUAKI, ANDO TOMONORI, SANEMORI EIJI, SUDO YOSHIKI
Year of Publication 09.01.2024

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Patent

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