Cold and Low-Energy Ion Etching (COLLIE)
Fujiwara, Nobuo, Shibano, Teruo, Nishioka, Kyusaku, Kato, Tadao
Published in Japanese Journal of Applied Physics (01.10.1989)
Published in Japanese Journal of Applied Physics (01.10.1989)
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Journal Article
ECR plasma etching with heavy halogen ions
FUJIWARA, N, SAWAI, H, YONEDA, M, NISHIOKA, K, ABE, H
Published in Japanese Journal of Applied Physics (01.10.1990)
Published in Japanese Journal of Applied Physics (01.10.1990)
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Journal Article
High performance electron cyclotron resonance plasma etching with control of magnetic field gradient
FUJIWARA, N, SAWAI, H, YONEDA, M, NISHIOKA, K, HORIE, K, NAKAMOTO, K, ABE, H
Published in Japanese Journal of Applied Physics (01.11.1991)
Published in Japanese Journal of Applied Physics (01.11.1991)
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Journal Article
Reactive ion beam etching using a selective gallium doping method
NISHIOKA, K, MORIMOTO, H, MASHIKO, Y, KATO, T
Published in Japanese Journal of Applied Physics (01.09.1989)
Published in Japanese Journal of Applied Physics (01.09.1989)
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Journal Article
Highly selective AlSiCu etching using BBr3 mixed-gas plasma
YONEDA, M, SAWAI, H, FUJIWARA, N, NISHIOKA, K, ABE, H
Published in Japanese Journal of Applied Physics (01.11.1990)
Published in Japanese Journal of Applied Physics (01.11.1990)
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Journal Article
Microfabrication of Anti-Reflective Chromium Mask by Gas Plasma
Abe, Haruhiko, Nishioka, Kyusaku, Tamura, Setsuko, Nishimoto, Akira
Published in Japanese Journal of Applied Physics (01.01.1976)
Published in Japanese Journal of Applied Physics (01.01.1976)
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Journal Article
Dynamic bottleneck control in wide variety production factory
Nakata, T., Matsui, K., Miyake, Y., Nishioka, K.
Published in IEEE transactions on semiconductor manufacturing (01.08.1999)
Published in IEEE transactions on semiconductor manufacturing (01.08.1999)
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