Dynamic gate resistance control for current balancing in parallel connected IGBTs
Sasaki, M., Nishio, H., Wai Tung Ng
Published in 2013 Twenty-Eighth Annual IEEE Applied Power Electronics Conference and Exposition (APEC) (01.03.2013)
Published in 2013 Twenty-Eighth Annual IEEE Applied Power Electronics Conference and Exposition (APEC) (01.03.2013)
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Conference Proceeding
Characteristic Analysis of a Micro DC-DC Converter for Portable Electronic Devices and an Improvement of Transient Response Characteristic
Sugahara, Satoshi, Yamada, Kouhei, Nishio, Haruhiko, Edo, Masaharu, Sato, Toshiro, Yamasawa, Kiyohito
Published in Electrical engineering in Japan (01.05.2011)
Published in Electrical engineering in Japan (01.05.2011)
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Journal Article
A Smart IGBT Gate Driver IC With Temperature Compensated Collector Current Sensing
Chen, Jingxuan, Zhang, Wei Jia, Shorten, Andrew, Yu, Jingshu, Sasaki, Masahiro, Kawashima, Tetsuya, Nishio, Haruhiko, Ng, Wai Tung
Published in IEEE transactions on power electronics (01.05.2019)
Published in IEEE transactions on power electronics (01.05.2019)
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Journal Article
Application of a Smart Gate Driver to Detect Aging in SiC Power MOSFETs
Wang, Mengqi, Zhang, Jiupeng, Ng, Wai Tung, Nishio, Haruhiko, Iwamoto, Motomitsu, Sumida, Hitoshi
Published in 2023 35th International Symposium on Power Semiconductor Devices and ICs (ISPSD) (28.05.2023)
Published in 2023 35th International Symposium on Power Semiconductor Devices and ICs (ISPSD) (28.05.2023)
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Conference Proceeding
A Smart Gate Driver for SiC Power MOSFETs with Aging Compensation and Ringing Suppression
Wang, Mengqi, Zhang, Wei Jia, Liang, Jingyuan, Cui, Wen Tao, Tung Ng, Wai, Nishio, Haruhiko, Sumida, Hitoshi, Nakajima, Hiroyuki
Published in 2021 33rd International Symposium on Power Semiconductor Devices and ICs (ISPSD) (30.05.2021)
Published in 2021 33rd International Symposium on Power Semiconductor Devices and ICs (ISPSD) (30.05.2021)
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Conference Proceeding
Improving Power Cycle Lifetime of SiC Power Modules with Double-Bonded Wire: Experimental and Simulation Analysis
Xiang, Enyao, Luo, Haoze, Yang, Huan, He, Xiangning, Fujishima, Naoto, Nishio, Haruhiko, Sumida, Hitoshi
Published in 2023 25th European Conference on Power Electronics and Applications (EPE'23 ECCE Europe) (04.09.2023)
Published in 2023 25th European Conference on Power Electronics and Applications (EPE'23 ECCE Europe) (04.09.2023)
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Conference Proceeding
Loop Height Effects on Bond Wire Reliability under Power cycling for SiC Power Module
Xiang, Enyao, Luo, Haoze, Yang, Huan, He, Xiangning, Fujishima, Naoto, Nishio, Haruhiko, Sumida, Hitoshi
Published in 2023 11th International Conference on Power Electronics and ECCE Asia (ICPE 2023 - ECCE Asia) (22.05.2023)
Published in 2023 11th International Conference on Power Electronics and ECCE Asia (ICPE 2023 - ECCE Asia) (22.05.2023)
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Conference Proceeding
High-efficiency dc-dc converter chip size module with integrated soft ferrite
Hayashi, Z., Katayama, Y., Edo, M., Nishio, H.
Published in IEEE transactions on magnetics (01.09.2003)
Published in IEEE transactions on magnetics (01.09.2003)
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Journal Article
Conference Proceeding
Identification Method for Various Failure Modes with Shared Kelvin and Power Wires Configuration in IGBT Power Modules
Wu, Qiang, Chen, Yu, Luo, Haoze, Zhang, Jian, Li, Wuhua, He, Xiangning, Fujishima, Naoto, Nishio, Haruhiko, Sumida, Hitoshi
Published in 2022 International Power Electronics Conference (IPEC-Himeji 2022- ECCE Asia) (15.05.2022)
Published in 2022 International Power Electronics Conference (IPEC-Himeji 2022- ECCE Asia) (15.05.2022)
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Conference Proceeding
A new level up shifter for HVICs with high noise tolerance
Akahane, Masashi, Jonishi, Akihiro, Yamaji, Masaharu, Kanno, Hiroshi, Tanaka, Takahide, Nishio, Haruhiko, Sumida, Hitoshi
Published in 2014 International Power Electronics Conference (IPEC-Hiroshima 2014 - ECCE ASIA) (01.05.2014)
Published in 2014 International Power Electronics Conference (IPEC-Hiroshima 2014 - ECCE ASIA) (01.05.2014)
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Conference Proceeding