Electrical interconnection in anodic bonding of silicon wafer to LTCC wafer using highly compliant porous bumps made from submicron gold particles
Tanaka, Shuji, Mohri, Mamoru, Ogashiwa, Toshinori, Fukushi, Hideyuki, Tanaka, Katsunao, Nakamura, Daisuke, Nishimori, Takashi, Esashi, Masayoshi
Published in Sensors and actuators. A. Physical. (01.12.2012)
Published in Sensors and actuators. A. Physical. (01.12.2012)
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Journal Article
Difference in Upper Extremity Spinal Motor Neuron Excitability and Function during Walking and Stepping in Place
Yuminaga, Hisanori, Isaka, Michiko, Hasegawa, Osamu, Niimura, Chizuko, Lee, Hanayo, Kanei, Kazuaki, Nishimori, Takashi
Published in Journal of Physical Therapy Science (2012)
Published in Journal of Physical Therapy Science (2012)
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Journal Article