Improvement in the mechanical properties of eutectic Sn58Bi alloy by 0.5 and 1 wt% Zn addition before and after thermal aging
Zhou, Shiqi, Mokhtari, Omid, Rafique, Muhammad Ghufran, Shunmugasamy, Vasanth C., Mansoor, Bilal, Nishikawa, Hiroshi
Published in Journal of alloys and compounds (15.10.2018)
Published in Journal of alloys and compounds (15.10.2018)
Get full text
Journal Article
Mechanism of Action of T-705 Ribosyl Triphosphate against Influenza Virus RNA Polymerase
SANGAWA, Hidehiro, KOMENO, Takashi, NISHIKAWA, Hiroshi, YOSHIDA, Atsushi, TAKAHASHI, Kazumi, NOMURA, Nobuhiko, FURUTA, Yousuke
Published in Antimicrobial Agents and Chemotherapy (01.11.2013)
Published in Antimicrobial Agents and Chemotherapy (01.11.2013)
Get full text
Journal Article
Fabrication and thermo-mechanical properties of Ag9In4 intermetallic compound
Liu, Xunda, Tatsumi, Hiroaki, Jin, Zhi, Chen, Zhong, Nishikawa, Hiroshi
Published in Intermetallics (01.11.2023)
Published in Intermetallics (01.11.2023)
Get full text
Journal Article
Robust shear strength of Cu–Au joint on Au surface-finished Cu disks by solid-state nanoporous Cu bonding
Park, Byungho, Saito, Mikiko, Mizuno, Jun, Nishikawa, Hiroshi
Published in Microelectronic engineering (01.05.2022)
Published in Microelectronic engineering (01.05.2022)
Get full text
Journal Article
Effect of Cu addition on the microstructure and mechanical properties of In–Sn-based low-temperature alloy
Han, Duy Le, Shen, Yu-An, He, Siliang, Nishikawa, Hiroshi
Published in Materials science & engineering. A, Structural materials : properties, microstructure and processing (15.02.2021)
Published in Materials science & engineering. A, Structural materials : properties, microstructure and processing (15.02.2021)
Get full text
Journal Article
Thermomigration induced microstructure and property changes in Sn-58Bi solders
Shen, Yu-An, Zhou, Shiqi, Li, Jiahui, Tu, K.N., Nishikawa, Hiroshi
Published in Materials & design (15.03.2019)
Published in Materials & design (15.03.2019)
Get full text
Journal Article
Improved thermal shock reliability of Ag paste sintered joint by adjusted coefficient of thermal expansion with Ag-Si atomized particles addition
Li, Wangyun, Chen, Chuantong, Nishijima, Masahiko, Ueshima, Minoru, Nishikawa, Hiroshi, Suganuma, Katsuaki
Published in Materials & design (01.10.2024)
Published in Materials & design (01.10.2024)
Get full text
Journal Article
Interface design and the strengthening-ductility behavior of tetra-needle-like ZnO whisker reinforced Sn1.0Ag0.5Cu composite solders prepared with ultrasonic agitation
Huo, Fupeng, Jin, Zhi, Le Han, Duy, Zhang, Keke, Nishikawa, Hiroshi
Published in Materials & design (15.11.2021)
Published in Materials & design (15.11.2021)
Get full text
Journal Article
Fabrication of Nanoporous Cu Sheet and Application to Bonding for High-Temperature Applications
Koga, Shunichi, Nishikawa, Hiroshi, Saito, Mikiko, Mizuno, Jun
Published in Journal of electronic materials (01.03.2020)
Published in Journal of electronic materials (01.03.2020)
Get full text
Journal Article
Effects of bonding temperature on microstructure, fracture behavior and joint strength of Ag nanoporous bonding for high temperature die attach
Kim, Min-Su, Nishikawa, Hiroshi
Published in Materials science & engineering. A, Structural materials : properties, microstructure and processing (01.10.2015)
Published in Materials science & engineering. A, Structural materials : properties, microstructure and processing (01.10.2015)
Get full text
Journal Article