The Influence of Surface Pit Shape on 4H-SiC MOSFETs Reliability under High Temperature Bias Tests
Uchida, Kosuke, Yamamoto, Hirofumi, Nishiguchi, Taro, Hiyoshi, Toru, Furumai, Masaki, Mikamura, Yasuki, Matsukawa, Shinji
Published in Materials Science Forum (24.05.2016)
Published in Materials Science Forum (24.05.2016)
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Nondestructive Analysis of Propagation of Stacking Faults in SiC Bulk Substrate and Epitaxial Layer by Photoluminescence Mapping
Hoshino, Norihiro, Tajima, Michio, Nishiguchi, Taro, Ikeda, Keiichi, Hayashi, Toshihiko, Kinoshita, Hiroyuki, Shiomi, Hiromu
Published in Japanese Journal of Applied Physics (01.10.2007)
Published in Japanese Journal of Applied Physics (01.10.2007)
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Thermal Etching of 6H–SiC Substrate Surface
Nishiguchi, Taro, Ohshima, Satoru, Nishino, Shigehiro
Published in Japanese Journal of Applied Physics (2003)
Published in Japanese Journal of Applied Physics (2003)
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