The Impact of Click and Collect’s Service Quality on Customer Emotion and Purchase Decision: A Case Study of Mobile World in Vietnam
Le, Quang Hung, Nguyen, Luu Thanh Tan, Pham, Ngoc Tram Anh
Published in The Journal of Asian finance, economics, and business (28.02.2019)
Published in The Journal of Asian finance, economics, and business (28.02.2019)
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Journal Article
Role of value compatibility in IT adoption
Bunker, Deborah, Kautz, Karl-Heinz, Nguyen, Anne Luu Thanh
Published in Journal of information technology (01.03.2007)
Published in Journal of information technology (01.03.2007)
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Journal Article
Copper passivation
Chowdhury, Mahmud Halim, Nguyen, Luu Thanh, Prabhu, Ashok, Poddar, Anindya
Year of Publication 01.06.2021
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Year of Publication 01.06.2021
Patent
Bump bond structure for enhanced electromigration performance
Yoshino, Makoto, Mishra, Dibyajat, Noguchi, Tomoko, Nguyen, Luu Thanh, Nguyen, Hau, Prabhu, Ashok, Poddar, Anindya
Year of Publication 20.09.2022
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Year of Publication 20.09.2022
Patent
Economic Growth and Multidimency Poverty Reduction in Vietnam
Tri, Nguyen Minh, Tam, Luu Thanh
Published in Turkish journal of computer and mathematics education (05.04.2021)
Published in Turkish journal of computer and mathematics education (05.04.2021)
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Journal Article
COPPER PASSIVATION
Chowdhury, Mahmud Halim, Nguyen, Luu Thanh, Prabhu, Ashok, Poddar, Anindya
Year of Publication 04.06.2020
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Year of Publication 04.06.2020
Patent
Fan-out electronic device
Nguyen, Hau Thanh, Masumoto, Mutsumi, Aoya, Kengo, Kim, Woochan, Nguyen, Luu Thanh, Matsuura, Masamitsu, Prabhu, Ashok, Poddar, Anindya, Yan, Yi
Year of Publication 09.08.2022
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Year of Publication 09.08.2022
Patent
Integrated circuit backside metallization
Sada, Hiroyuki, Iriguchi, Shoichi, Yano, Genki, Nguyen, Luu Thanh, Nguyen, Hau, Prabhu, Ashok, Poddar, Anindya, Yan, Yi
Year of Publication 21.06.2022
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Year of Publication 21.06.2022
Patent
BUMP BOND STRUCTURE FOR ENHANCED ELECTROMIGRATION PERFORMANCE
Yoshino, Makoto, Mishra, Dibyajat, Noguchi, Tomoko, Nguyen, Luu Thanh, Nguyen, Hau, Prabhu, Ashok, Poddar, Anindya
Year of Publication 24.12.2020
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Year of Publication 24.12.2020
Patent
REPASSIVATION APPLICATION FOR WAFER-LEVEL CHIP-SCALE PACKAGE
Shibuya, Makoto, Komatsu, Daiki, Nguyen, Luu Thanh, Nguyen, Hau, Yan, Yi
Year of Publication 10.12.2020
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Year of Publication 10.12.2020
Patent
Bump bond structure for enhanced electromigration performance
Yoshino, Makoto, Mishra, Dibyajat, Noguchi, Tomoko, Nguyen, Luu Thanh, Nguyen, Hau, Prabhu, Ashok, Poddar, Anindya
Year of Publication 01.09.2020
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Year of Publication 01.09.2020
Patent
INTEGRATED CIRCUIT BACKSIDE METALLIZATION
YAN, Yi, PODDAR, Anindya, NGUYEN, Hau, SADA, Hiroyuki, YANO, Genki, NGUYEN, Luu Thanh, PRABHU, Ashok, IRIGUCHI, Shoichi
Year of Publication 04.02.2021
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Year of Publication 04.02.2021
Patent