Anomalously high tensile creep rates from thin cast Sn3.9Ag0.6Cu lead-free solder
QIANG XIAO, LUU NGUYEN, ARMSTRONG, William D
Published in Journal of electronic materials (01.07.2005)
Published in Journal of electronic materials (01.07.2005)
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Journal Article
FPGA Oriented Compression of DNN Using Layer-Targeted Weights and Activations Quantization
Quoc Hoang, Minh, Luu Nguyen, Phong, Viet Tran, Hong, Quan Nguyen, Hong, Thang Nguyen, Vu, Vo-Le, Cuong
Published in 2020 IEEE Eighth International Conference on Communications and Electronics (ICCE) (13.01.2021)
Published in 2020 IEEE Eighth International Conference on Communications and Electronics (ICCE) (13.01.2021)
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Conference Proceeding
Failure mechanisms of boards in a thin wafer level chip scale package
Rajmane, Pavan, Khan, Hassaan Ahmad, Doiphode, Aniruddha, Rahangdale, Unique, Agonafer, Dereje, Lohia, Alok, Kummerl, Steven, Luu Nguyen
Published in 2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (01.05.2017)
Published in 2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (01.05.2017)
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Conference Proceeding
Diversity and Hungarian teachers' views on nationalism, migration and multiculturalism
Nguyen Luu, Lan Anh, Boreczky, Ágnes
Published in Intercultural education (London, England) (04.05.2022)
Published in Intercultural education (London, England) (04.05.2022)
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Journal Article
0557 Sleep apnea detection using photoplethysmography using wearable electronic devices : A systematic review and meta-analysis
Sharma, Rohit, Nguyen-Luu, Tristan, Singh, Prashant Kumar, Sardar, Sundus, Saraza, Mohammad, Abbas, Sayeda Z, Mirza, Wasique
Published in Sleep (New York, N.Y.) (29.05.2023)
Published in Sleep (New York, N.Y.) (29.05.2023)
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Journal Article
Linear-quadratic mean field teams with a major agent
Minyi Huang, Son Luu Nguyen
Published in 2016 IEEE 55th Conference on Decision and Control (CDC) (01.12.2016)
Published in 2016 IEEE 55th Conference on Decision and Control (CDC) (01.12.2016)
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Conference Proceeding
Prognostication of copper-aluminum wirebond reliability under high temperature storage and temperature-humidity
Lall, Pradeep, Deshpande, Shantanu, Nguyen, Luu, Murtuza, Masood
Published in 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) (01.05.2014)
Published in 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) (01.05.2014)
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Conference Proceeding
Would external debts promote sustainable development in emerging and low‐income countries?
Luu, Hiep Ngoc, Luu, Nguyen Hanh, Phung, Huong Thi Thu
Published in Journal of international development (01.03.2024)
Published in Journal of international development (01.03.2024)
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Journal Article
Prognostication of Cu-Al WB system subjected to high temperature-humidity condition
Lall, Pradeep, Deshpande, Shantanu, Luu Nguyen
Published in 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (01.05.2016)
Published in 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (01.05.2016)
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Conference Proceeding
Model for Interaction of EMC Formulation with Operating Current and Reliability of Cu-Al Wirebonds Operating in Harsh Environments
Lall, Pradeep, Deshpande, Shantanu, Yihua Luo, Luu Nguyen
Published in 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) (01.05.2017)
Published in 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) (01.05.2017)
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Conference Proceeding
Deep Learning for Aspect Detection on Vietnamese Reviews
Thin, Dang Van, Nguye, Vu Duc, Nguyen, Kiet Van, Nguyen, Ngan Luu-Thuy
Published in 2018 5th NAFOSTED Conference on Information and Computer Science (NICS) (01.11.2018)
Published in 2018 5th NAFOSTED Conference on Information and Computer Science (NICS) (01.11.2018)
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Conference Proceeding
Additive Manufacturing of Magnetic Components for Heterogeneous Integration
Yi Yan, Lanbing Liu, Chao Ding, Luu Nguyen, Moss, Jim, Yunhui Mei, Guo-Quan Lu
Published in 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) (01.05.2017)
Published in 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) (01.05.2017)
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Conference Proceeding
Non-destructive Failure Analysis of Various Chip to Package Interaction Anomalies in FCBGA Packages Subjected to Temperature Cycle Reliability Testing
B. Reddy, Vishnu V., Ume, I. Charles, Williamson, Jaimal, Nguyen, Luu
Published in 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) (01.05.2019)
Published in 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) (01.05.2019)
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Conference Proceeding
LSTM Easy-first Dependency Parsing with Pre-trained Word Embeddings and Character-level Word Embeddings in Vietnamese
Nguyen, Binh Duc, Nguyen, Kiet Van, Nguyen, Ngan Luu-Thuy
Published in 2018 10th International Conference on Knowledge and Systems Engineering (KSE) (01.11.2018)
Published in 2018 10th International Conference on Knowledge and Systems Engineering (KSE) (01.11.2018)
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Conference Proceeding
Comprehensive validation of a cell-free DNA-based assay for multi-cancer detection: A Vietnamese longitudinal prospective cohort study of 9,024 participants
Tran, Le Son, Nguyen, Thi Hue Hanh, Nguyen, Luu Hong Dang, Nguyen, Trong Hieu, Nguyen, Thanh Dat, Giang, Hoa, Phan, Minh Duy, Nguyen, Duy Sinh, Tang, Hung Sang, Nguyen, Hoai-Nghia
Published in Journal of clinical oncology (10.08.2024)
Published in Journal of clinical oncology (10.08.2024)
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