Structure for modeling stress-induced degradation of conductive interconnects
Chanda, Kaushik, Agarwala, Birendra, Clevenger, Lawrence A, Cowley, Andrew P, Filippi, Ronald G, Gill, Jason P, Lee, Tom C, Li, Baozhen, McLaughlin, Paul S, Nguyen, Du B, Rathore, Hazara S, Sullivan, Timothy D, Yang, Chih-Chao
Year of Publication 06.04.2010
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Year of Publication 06.04.2010
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Structure for monitoring stress-induced degradation of conductive interconnects
Chanda, Kaushik, Agarwala, Birendra, Clevenger, Lawrence A, Cowley, Andrew P, Filippi, Ronald G, Gill, Jason P, Lee, Tom C, Li, Baozhen, McLaughlin, Paul S, Nguyen, Du B, Rathore, Hazara S, Sullivan, Timothy D, Yang, Chih-Chao
Year of Publication 29.12.2009
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Year of Publication 29.12.2009
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Structure and method for monitoring stress-induced degradation of conductive interconnects
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Year of Publication 08.07.2008
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Stacked via-stud with improved reliability in copper metallurgy
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Year of Publication 06.12.2005
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Year of Publication 06.12.2005
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Structure for modeling stress-induced degradation of conductive interconnects
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Year of Publication 06.04.2010
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Year of Publication 06.04.2010
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Structure for monitoring stress-induced degradation of conductive interconnects
COWLEY ANDREW P, RATHORE HAZARA S, CLEVENGER LAWRENCE A, AGARWALA BIRENDRA, CHANDA KAUSHIK, FILIPPI RONALD G, SULLIVAN TIMOTHY D, LEE TOM C, MCLAUGHLIN PAUL S, NGUYEN DU B, LI BAOZHEN, GILL JASON P, YANG CHIHAO
Year of Publication 29.12.2009
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Year of Publication 29.12.2009
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Structure for modeling stress-induced degradation of conductive interconnects
COWLEY ANDREW P, RATHORE HAZARA S, CLEVENGER LAWRENCE A, AGARWALA BIRENDRA, CHANDA KAUSHIK, FILIPPI RONALD G, SULLIVAN TIMOTHY D, LEE TOM C, MCLAUGHLIN PAUL S, NGUYEN DU B, LI BAOZHEN, GILL JASON P, YANG CHIHAO
Year of Publication 25.09.2008
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Year of Publication 25.09.2008
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Structure and method for monitoring stress-induced degradation of conductive interconnects
COWLEY ANDREW P, RATHORE HAZARA S, CLEVENGER LAWRENCE A, AGARWALA BIRENDRA, CHANDA KAUSHIK, FILIPPI RONALD G, SULLIVAN TIMOTHY D, LEE TOM C, MCLAUGHLIN PAUL S, NGUYEN DU B, LI BAOZHEN, GILL JASON P, YANG CHIHAO
Year of Publication 08.07.2008
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Year of Publication 08.07.2008
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Method for monitoring stress-induced degradation of conductive interconnects
COWLEY ANDREW P, RATHORE HAZARA S, CLEVENGER LAWRENCE A, AGARWALA BIRENDRA, CHANDA KAUSHIK, FILIPPI RONALD G, SULLIVAN TIMOTHY D, LEE TOM C, MCLAUGHLIN PAUL S, NGUYEN DU B, LI BAOZHEN, GILL JASON P, YANG CHIHAO
Year of Publication 08.05.2008
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Year of Publication 08.05.2008
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STRUCTURE AND METHOD FOR MONITORING STRESS-INDUCED DEGRADATION OF CONDUCTIVE INTERCONNECTS
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Year of Publication 24.05.2007
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Year of Publication 07.03.2000
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Stacked via-stud with improved reliability in copper metallurgy
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Year of Publication 30.05.2000
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