Finite element analysis of wire bonding non-stick issue in miniaturized package development
Weiqiang Li, Haibin Chen, Jingshen Wu, Ke Xue, Fei Wong, Wai Keung Ng, Guangxu Cheng
Published in 2013 14th International Conference on Electronic Packaging Technology (01.08.2013)
Published in 2013 14th International Conference on Electronic Packaging Technology (01.08.2013)
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Conference Proceeding
Phase Ⅰ/Ⅱ randomized controlled trial of autologous bone marrow-derived mesenchymal stem cell therapy for chronic stroke
Tsang, Kam Sze, Ng, Chi Ping Stephanie, Zhu, Xian Lun, Wong, George Kwok Chu, Lu, Gang, Ahuja, Anil Tejbhan, Wong, Ka Sing Lawrence, Ng, Ho Keung, Poon, Wai Sang
Published in World journal of stem cells (26.08.2017)
Published in World journal of stem cells (26.08.2017)
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Journal Article
A leadless semiconductor package and method
Habenicht, Soenke, Chi Ho Leung, Chan, San Ming, Xue, Ke, Hor, Wai Hung William, Ng, Wai Keung
Year of Publication 27.11.2019
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Year of Publication 27.11.2019
Patent
Investigation of drinking water bacterial community through high-throughput sequencing
Ng, Tsz Wai, Huang, Guocheng, Wong, Po Keung
Published in Journal of environmental sciences (China) (01.11.2015)
Published in Journal of environmental sciences (China) (01.11.2015)
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Journal Article
Leadless semiconductor package and method
Xue Ke, Hor Wai Hung William, Leung Chi Ho, Chan San Ming, Ng Wai Keung, Habenicht Soenke
Year of Publication 13.09.2016
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Year of Publication 13.09.2016
Patent
A leadless semiconductor package and method
KE XUE, WAI HUNG WILLIAM HOR, WAI KEUNG NG, SAN MING CHAN, CHI HO LEUNG, SOENKE HABENICHT
Year of Publication 10.02.2016
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Year of Publication 10.02.2016
Patent
LEADLESS SEMICONDUCTOR PACKAGE AND METHOD
NG WAI KEUNG, XUE KE, LEUNG CHI HO, HOR WAI HUNG WILLIAM, CHAN SAN MING, HABENICHT SOENKE
Year of Publication 04.02.2016
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Year of Publication 04.02.2016
Patent
A leadless semiconductor package and method
CHAN, SAN MING, NG, WAI KEUNG, HOR, WAI HUNG WILLIAM, HABENICHT, SOENKE, CHI HO LEUNG, XUE, KE
Year of Publication 03.02.2016
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Year of Publication 03.02.2016
Patent