IC having a metal ring thereon for stress reduction
Gurrum, Siva Prakash, Koduri, Sreenivasan Kalyani, Nangia, Amit Sureshkumar, Manack, Christopher Daniel
Year of Publication 09.01.2024
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Year of Publication 09.01.2024
Patent
Correlated Model for Wafer Warpage Prediction of Arbitrarily Patterned Films
Ostrowicki, Gregory T., Gurrum, Siva P., Nangia, Amit
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
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Conference Proceeding
Thermal cycling reliability of SnAgCu solder joints in WLCSP
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Published in 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) (01.12.2014)
Published in 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) (01.12.2014)
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Conference Proceeding
Reduction of Cu-Ni-Pd pad discoloration caused by Cu re-deposition
Clemente, Laura May Antoinette, Kejun Zeng, Nangia, Amit
Published in 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) (01.11.2016)
Published in 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) (01.11.2016)
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Conference Proceeding
IC HAVING A METAL RING THEREON FOR STRESS REDUCTION
Gurrum, Siva Prakash, Koduri, Sreenivasan Kalyani, Nangia, Amit Sureshkumar, Manack, Christopher Daniel
Year of Publication 20.10.2022
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Year of Publication 20.10.2022
Patent
IC having a metal ring thereon for stress reduction
Gurrum, Siva Prakash, Koduri, Sreenivasan Kalyani, Nangia, Amit Sureshkumar, Manack, Christopher Daniel
Year of Publication 12.07.2022
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Year of Publication 12.07.2022
Patent