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LEAD FRAME USING CHIP PAD AS HEAT DISSIPATION PASSAGE AND SEMICONDUCTOR PACKAGE INCLUDING IT
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NAN JIHAKU
Year of Publication
30.03.2001
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SEMICONDUCTOR PACKAGE STRUCTURE UTILIZING EPOXY MOLDING COMPOUND AND MANUFACTURE OF EPOXY MOLDING COMPOUND
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NAN JIHAKU
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22.01.1999
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POWER ELEMENT WITH MULTI-CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
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NAN JIHAKU
,
ZEN GOSHO
Year of Publication
20.04.2001
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SEMICONDUCTOR ELEMENT, BONDING OF DIE OF SEMICONDUCTOR ELEMENT AND DEVICE
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NAN JIHAKU
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KIM DONG-KUK
Year of Publication
14.03.2000
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SEMICONDUCTOR PACKAGE STRUCTURE
by
BOKU SHOKON
,
NAN JIHAKU
,
KEN DAIKUN
Year of Publication
31.03.1998
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Patent
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chemistry
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medicine
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Topic
basic electric elements
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electric solid state devices not otherwise provided for
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electricity
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semiconductor devices
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general tagging of cross-sectional technologies spanning over several sections of the ipc
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general tagging of new technological developments
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esp@cenet
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