Thermal ratcheting of solder-bonded elastic and elastoplastic layers
Nakane, Kazuhiko, Ohno, Nobutada, Tsuda, Masatoshi, Yagi, Yuji, Nakagawa, Ikuo, Atsumi, Takashi
Published in International journal of plasticity (01.10.2008)
Published in International journal of plasticity (01.10.2008)
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Journal Article
Warpage variations of Si/solder/OFHC-Cu layered plates subjected to cyclic thermal loading
Tanie, Hisashi, Nakane, Kazuhiko, Urata, Yusuke, Tsuda, Masatoshi, Ohno, Nobutada
Published in Microelectronics and reliability (01.09.2011)
Published in Microelectronics and reliability (01.09.2011)
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