POLYIMIDE-BASED ADHESIVE
SUGIMOTO KEISUKE, SHIOTANI ATSUSHI, NAKAMURA TAIYOU, TASAKI TAKASHI, YAMAGUCHI TAKASHI
Year of Publication 06.07.2017
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Year of Publication 06.07.2017
Patent
COPPER FOIL WITH RESIN, COPPER-CLAD LAMINATE, PRINTED WIRING BOARD AND MULTILAYER WIRING BOARD
TAZAKI TAKASHI, TSUJI MASAYUKI, SHIOTANI ATSUSHI, NAKAMURA TAIYOU, YAMAGUCHI TAKASHI
Year of Publication 06.07.2017
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Year of Publication 06.07.2017
Patent
POLYIMIDE-BASED ADHESIVE
TAZAKI TAKASHI, SUGIMOTO KEISUKE, SHIOTANI ATSUSHI, NAKAMURA TAIYOU, YAMAGUCHI TAKASHI
Year of Publication 06.07.2017
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Year of Publication 06.07.2017
Patent
ADHESIVE COMPOSITION, FILM-LIKE ADHESIVE MATERIAL, ADHESIVE LAYER, ADHESIVE SHEET, COPPER FOIL WITH RESIN, COPPER-CLAD LAMINATE, FLEXIBLE COPPER-CLAD LAMINATE, PRINTED CIRCUIT BOARD, FLEXIBLE PRINTED CIRCUIT BOARD, MULTILAYER WIRING BOARD, PRINTED CIRCUIT BOARD, AND FLEXIBLE PRINTED CIRCUIT BOARD
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Patent
Photosensitive Polyimides Compositions with Good Flexibility and Low Dielectric Property for Heterogeneous Chiplet Integration Technologies
Tasaki, Takashi, Yamaguchi, Takashi, Nakamura, Taiyou, Yamashita, Madoka
Published in 2024 International Conference on Electronics Packaging (ICEP) (17.04.2024)
Published in 2024 International Conference on Electronics Packaging (ICEP) (17.04.2024)
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Conference Proceeding
Photosensitive Polyimides Compositions with Low Dielectric Property and Good Flexibility Corresponding to Redistribution Layers for Next Generation Heterogeneous Integration technologies
Tazaki, Takashi, Yamaguchi, Takashi, Nakamura, Taiyou, Yamashita, Madoka
Published in 2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (25.10.2023)
Published in 2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (25.10.2023)
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Conference Proceeding
Novel Photosensitive Polyimides Compositions with Low Dielectric Property and Good Flexibility Corresponding to Redistribution Layers for High Speed Transmission Applications
Tazaki, Takashi, Yamaguchi, Takashi, Nakamura, Taiyou, Yamashita, Madoka
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)
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Conference Proceeding
CURABLE PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT, RESIST PATTERN, METHOD OF PRODUCING RESIST PATTERN, SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE
Shiotani, Atsushi, Yamashita, Madoka, Sugimoto, Keisuke, Tasaki, Takashi, Nakamura, Taiyou, Yamaguchi, Takashi
Year of Publication 30.03.2023
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Year of Publication 30.03.2023
Patent
The low Dk / Df adhesives for high frequency printed circuit board using the novel solvent soluble polyimide
Tasaki, Takashi, Shiotani, Atsushi, Tsuji, Masayuki, Nakamura, Taiyou, Yamaguchi, Takashi
Published in 2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2015)
Published in 2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2015)
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Conference Proceeding
TWI777950B
TASAKI, TAKASHI, YAMAGUCHI, TAKASHI, SHIOTANI, ATSUSHI, SUGIMOTO, KEISUKE, NAKAMURA, TAIYOU
Year of Publication 21.09.2022
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Year of Publication 21.09.2022
Patent
Curable photosensitive resin composition, cured product, resist pattern and method of producing the same, semiconductor device and electronic device
YAMASHITA, MADOKA, TASAKI, TAKASHI, YAMAGUCHI, TAKASHI, SHIOTANI, ATSUSHI, SUGIMOTO, KEISUKE, NAKAMURA, TAIYOU
Year of Publication 16.05.2023
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Year of Publication 16.05.2023
Patent
Adhesive composition, cured product, adhesive sheet, copper foil with resin, copper-clad laminate, and printed wiring board having both a low dielectric constant and a low dielectric loss tangent
YAMASHITA, MADOKA, TASAKI, TAKASHI, YAMAGUCHI, TAKASHI, SHIOTANI, ATSUSHI, SUGIMOTO, KEISUKE, NAKAMURA, TAIYOU
Year of Publication 16.10.2022
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Year of Publication 16.10.2022
Patent
Polyimide resin composition, adhesive composition, film adhesive material, adhesive sheet, copper foil with resin, copper clad laminate, printed wiring board and polyimide film a polyimide resin layer with low dielectric constant, low dielectric loss tangent and excellent solder heat resistance
YAMASHITA, MADOKA, TASAKI, TAKASHI, YAMAGUCHI, TAKASHI, SHIOTANI, ATSUSHI, SUGIMOTO, KEISUKE, NAKAMURA, TAIYOU
Year of Publication 01.09.2022
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Year of Publication 01.09.2022
Patent
Adhesive composition, cured product, adhesive sheet, copper foil with resin, copper clad laminate, and printed wiring board wherein the layer of an adhesive composition has excellent heat resistance to solder even with a small amount of a crosslinking agent and realizes low dielectric constant and low dielectric loss tangent
YAMASHITA, MADOKA, TASAKI, TAKASHI, YAMAGUCHI, TAKASHI, SHIOTANI, ATSUSHI, SUGIMOTO, KEISUKE, NAKAMURA, TAIYOU
Year of Publication 16.06.2022
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Year of Publication 16.06.2022
Patent
Polyimide, polyimide-based adhesive, film-like adhesive material, adhesive layer, adhesive sheet, copper foil with resin, copper-clad laminate and printed wiring board, and multilayer wiring board and method for manufacturing the same
TASAKI, TAKASHI, YAMAGUCHI, TAKASHI, SHIOTANI, ATSUSHI, SUGIMOTO, KEISUKE, NAKAMURA, TAIYOU
Year of Publication 16.02.2018
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Year of Publication 16.02.2018
Patent