Time evolution of strain distribution under bonding pad during ultrasonic wire-bonding at 200°C
Sakamoto, Mamoru, Nakadozono, Kenichi, Iwanabe, Keiichiro, Asano, Tanemasa
Published in 2017 IEEE CPMT Symposium Japan (ICSJ) (01.11.2017)
Published in 2017 IEEE CPMT Symposium Japan (ICSJ) (01.11.2017)
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Conference Proceeding
Dynamic Strain of Ultrasonic Cu and Au Ball Bonding Measured In-Situ by Using Silicon Piezoresistive Sensor
Iwanabe, Keiichiro, Nakadozono, Kenichi, Sakamoto, Mamoru, Asano, Tanemasa
Published in 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) (01.05.2017)
Published in 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) (01.05.2017)
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Conference Proceeding
Time evolution of strain distribution during ultrasonic bonding of Cu wire: Impact of bonding temperature
Sakamoto, Mamoru, Nakadozono, Kenichi, Iwanabe, Keiichiro, Asano, Tanemasa
Published in 2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition (01.09.2017)
Published in 2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition (01.09.2017)
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Conference Proceeding
In-situ strain measurement of ultrasonic ball bonding
Iwanabe, Keiichiro, Nakadozono, Kenichi, Senda, Yosuke, Asano, Tanemasa
Published in 2016 6th Electronic System-Integration Technology Conference (ESTC) (01.09.2016)
Published in 2016 6th Electronic System-Integration Technology Conference (ESTC) (01.09.2016)
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Conference Proceeding
Room-temperature ultrasonic-bonding characteristics of compliant micro-bump investigated by ex-situ and in-situ measurements
Iwanabe, Keiichiro, Nakadozono, Kenichi, Senda, Yosuke, Asano, Tanemasa
Published in 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) (01.12.2015)
Published in 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) (01.12.2015)
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Conference Proceeding