Organic Multi-Channel Optoelectronic Sensors for Wearable Health Monitoring
Khan, Yasser, Han, Donggeon, Ting, Jonathan, Ahmed, Maruf, Nagisetty, Ramune, Arias, Ana C.
Published in IEEE access (2019)
Published in IEEE access (2019)
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Journal Article
3DIC Design Challenges, Early Solutions and Future Recommendations
Kolesov, Victoria, Rajan, Vivek, Nagisetty, Ramune
Published in 2021 IEEE Custom Integrated Circuits Conference (CICC) (01.04.2021)
Published in 2021 IEEE Custom Integrated Circuits Conference (CICC) (01.04.2021)
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Conference Proceeding
Multi-die Integration Using Advanced Packaging Technologies
Lee, Hyung-Jin, Mahajan, Ravi, Sheikh, Farhana, Nagisetty, Ramune, Deo, Manish
Published in 2020 IEEE Custom Integrated Circuits Conference (CICC) (01.03.2020)
Published in 2020 IEEE Custom Integrated Circuits Conference (CICC) (01.03.2020)
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Conference Proceeding
A 90-nm logic technology featuring strained-silicon
Thompson, S.E., Armstrong, M., Auth, C., Alavi, M., Buehler, M., Chau, R., Cea, S., Ghani, T., Glass, G., Hoffman, T., Jan, C.-H., Kenyon, C., Klaus, J., Kuhn, K., Zhiyong Ma, Mcintyre, B., Mistry, K., Murthy, A., Obradovic, B., Nagisetty, R., Phi Nguyen, Sivakumar, S., Shaheed, R., Shifren, L., Tufts, B., Tyagi, S., Bohr, M., El-Mansy, Y.
Published in IEEE transactions on electron devices (01.11.2004)
Published in IEEE transactions on electron devices (01.11.2004)
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Journal Article
Convergence of SoC architecture and semiconductor manufacturing through AI/ML systems
Bodapati, Srinivas, Ranade, Pushkar, Nagisetty, Ramune
Published in 2021 58th ACM/IEEE Design Automation Conference (DAC) (05.12.2021)
Published in 2021 58th ACM/IEEE Design Automation Conference (DAC) (05.12.2021)
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Conference Proceeding
CONTEXT-BASED MESSAGE CREATION VIA USER-SELECTABLE ICONS
FERNANDEZ FRANCISCO J, DURHAM LENITRA M, NAGISETTY RAMUNE, BROTMAN RYAN S, HUANG WEN LING M, VEMBAR DEEPAK S, ANDERSON GLEN J, SHERMAN JAMIE, DENMAN PETE A, RAFFA GIUSEPPE B, MUSE PHILIP A
Year of Publication 29.03.2016
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Year of Publication 29.03.2016
Patent
2.5D and 3D Heterogeneous Integration: Emerging applications
Sheikh, Farhana, Nagisetty, Ramune, Karnik, Tanay, Kehlet, David
Published in IEEE solid state circuits magazine (01.01.2021)
Published in IEEE solid state circuits magazine (01.01.2021)
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Journal Article