Effect of thiourea on electrochemical nucleation and electrochemical impedance spectroscopy of electrodeposited tin on a copper substrate in a sulfate bath
Lee, Mi-Ri, Na, Seong-Hun, Park, Hwa-Sun, Suh, Su-Jeong
Published in Journal of nanoscience and nanotechnology (01.12.2014)
Published in Journal of nanoscience and nanotechnology (01.12.2014)
Get more information
Journal Article
Effect of a high-temperature pre-bake treatment on whisker formation under various thermal and humidity conditions for electrodeposited tin films on copper substrates
Na, Seong-Hun, Lee, Mi-Ri, Park, Hwa-Sun, Kim, Heung-Kyu, Suh, Su-Jeong
Published in Metals and materials international (01.03.2014)
Published in Metals and materials international (01.03.2014)
Get full text
Journal Article
Experimental study of bump void formation according to process conditions
Na, Seong-Hun, Lim, Seung-Kyu, Kim, Jin-Soo, Park, Hwa-Sun, Oh, Heung-Jae, Choi, Jin-Won, Suh, Su-Jeong
Published in Microelectronics and reliability (01.04.2013)
Published in Microelectronics and reliability (01.04.2013)
Get full text
Journal Article
Fabrication of a two-step Ni stamp for blind via hole application on PWB
Park, In-Soo, Kim, Jin-Soo, Na, Seong-Hun, Lim, Seung-Kyu, Oh, Young-Soo, Suh, Su-Jeong
Published in Microelectronic engineering (01.11.2010)
Published in Microelectronic engineering (01.11.2010)
Get full text
Journal Article
Effect of a Pd sacrifice layer on the interfacial reaction in Sn-3.5Ag/Pd/Cu
Na, Seong-Hun, Kim, Jin-Soo, Lim, Seung-Kyu, Suh, Su-Jeong
Published in Journal of the Korean Physical Society (01.10.2012)
Published in Journal of the Korean Physical Society (01.10.2012)
Get full text
Journal Article
Bulk-acoustic resonator module
Lee, Jae Chang, Lee, Tae Kyung, Park, Seung Wook, Jung, Jae Hyun, Na, Seong Hun
Year of Publication 18.10.2022
Get full text
Year of Publication 18.10.2022
Patent
Bulk-acoustic wave resonator
Jeong, Dae Hun, Lee, Jae Chang, Son, Sang Uk, Park, Seung Wook, Jung, Jae Hyun, Na, Seong Hun
Year of Publication 15.03.2022
Get full text
Year of Publication 15.03.2022
Patent
Semiconductor package and manufacturing method thereof
Lee, Hwa Sun, Park, Tah Joon, Park, Seung Wook, Jung, Jae Hyun, Na, Seong Hun
Year of Publication 19.11.2019
Get full text
Year of Publication 19.11.2019
Patent
ACOUSTIC WAVE RESONATOR PACKAGE
NA, Seong Hun, HAN, Sung, PARK, Jang Ho, PARK, Seung Wook, JUNG, Jae Hyun
Year of Publication 08.06.2023
Get full text
Year of Publication 08.06.2023
Patent
WAFER LEVEL PACKAGE AND METHOD OF MANUFACTURING THE SAME
NA, Seong Hun, KIM, Kwang Su, LEE, Sung Jun, PARK, Seung Wook, JUNG, Jae Hyun, PARK, Dong Hyun, KIM, Yong Suk
Year of Publication 18.04.2024
Get full text
Year of Publication 18.04.2024
Patent