A multichip package for high-speed logic die
Myszka, E.G., Casey, A., Trent, J.
Published in 1992 Proceedings 42nd Electronic Components & Technology Conference (1992)
Published in 1992 Proceedings 42nd Electronic Components & Technology Conference (1992)
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Conference Proceeding
Approaches to cost reducing MCM-D substrate fabrication
Tessier, T.G., Myszka, E.G.
Published in Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93) (1993)
Published in Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93) (1993)
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Conference Proceeding
A multichip package for high-speed logic die
Myszka, E.G., Dixon, A.C., Trent, J.
Published in IEEE transactions on components, hybrids, and manufacturing technology (01.02.1993)
Published in IEEE transactions on components, hybrids, and manufacturing technology (01.02.1993)
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Journal Article
Conference Proceeding