Education in Post-Coup Myanmar: A Shattered Landscape with Resilient Actors
Salem-Gervais, Nicolas, Aung, Summer, Spreelung, Amber, Seng, Ja, Wai, Phyo, Sett Paing, Myo, Sian Lian, Pau
Year of Publication 2024
Year of Publication 2024
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Newly developed integration method for biomedical implants using flexible polymer cable
Yu Daquan, Cheng Ming-Yuan, Lim Li Shiah, Myo Paing, Yu Aibin
Published in 2010 12th Electronics Packaging Technology Conference (01.12.2010)
Published in 2010 12th Electronics Packaging Technology Conference (01.12.2010)
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Conference Proceeding
Novel chip stacking process for 3D integration
Jaesik Lee, Fernandez, D. M., Myo Paing, Yen Chen Yeo, Shan Gao
Published in 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) (01.05.2011)
Published in 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) (01.05.2011)
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Conference Proceeding
3D stacking by hybrid bonding with low temperature solder
Paing Myo, Ser Choong Chong, Ling Xie, Soon Wee Ho, Wai Hong See Toh, Tai Chong Chai
Published in 2010 12th Electronics Packaging Technology Conference (01.12.2010)
Published in 2010 12th Electronics Packaging Technology Conference (01.12.2010)
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Conference Proceeding
Embedding of 15um thin chip and passives in thin flexible substrate
Rajoo, Ranjan, Lim, Y Y, Chong, S C, Myo Paing, Moses, F D, Hong, Justin See Toh Wai, Sekhar, V N, Soon Wee Ho, Thew, S, Soon, Justin Wee Kim, Xiaowu Zhang
Published in 2010 12th Electronics Packaging Technology Conference (01.12.2010)
Published in 2010 12th Electronics Packaging Technology Conference (01.12.2010)
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Conference Proceeding
Packaging and testing of electro-magnetically actuated silicon micro mirror for Pico-projector applications
Ling Xie, Paing Myo, Ser Choong Chong, Soon Wee Ho, Wee, J, Premachandran, C S, Wang, S, Herer, Inbal, Baram, A
Published in 2010 12th Electronics Packaging Technology Conference (01.12.2010)
Published in 2010 12th Electronics Packaging Technology Conference (01.12.2010)
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Conference Proceeding
Abnormal Behavior Detection in Real-time for Advanced Driver Assistance System (ADAS) using YOLO
Soe, May Thu, Zaw Min, Aung, Kyaw, Hayma Thida, Min Paing, Myo, Htet, Sai Myo, Aye, Bawin
Published in 2022 IEEE Symposium on Industrial Electronics & Applications (ISIEA) (16.07.2022)
Published in 2022 IEEE Symposium on Industrial Electronics & Applications (ISIEA) (16.07.2022)
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Conference Proceeding
Optoelectronic device subassemblies and methods of manufacturing the same
Yi, Xu, Wang, Ji, Gubser, Simon, Ong, Eunice Ho Hui, Rudmann, Hartmut, Lua, Edmund Koon Tian, Paing, Myo, Tang, Jian, Liu, Hongyuan, Lee, Ming Jie, Yu, Qichuan, Tesanovic, Bojan
Year of Publication 26.03.2019
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Year of Publication 26.03.2019
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OPTOELECTRONIC MODULES INCLUDING OPTOELECTRONIC DEVICE SUBASSEMBLIES AND METHODS OF MANUFACTURING THE SAME
Lua Edmund Koon Tian, Yu Qichuan, Ong Eunice Ho Hui, Lee Ming Jie, Tesanovic Bojan, Wang Ji, Yi Xu, Paing Myo, Rudmann Hartmut, Gubser Simon, Liu Hongyuan, Tang Jian
Year of Publication 04.01.2018
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Year of Publication 04.01.2018
Patent
OPTOELECTRONIC MODULES INCLUDING OPTOELECTRONIC DEVICE SUBASSEMBLIES AND METHODS OF MANUFACTURING THE SAME
PAING, Myo, LEE, Ming Jie, WANG, Ji, TANG, Jian, GUBSER, Simon, TESANOVIC, Bojan, ONG, Eunice Ho, YI, Xu, YU, Qichuan, LUA, Edmund Koon, LIU, Hongyuan, RUDMANN, Hartmut
Year of Publication 04.01.2018
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Year of Publication 04.01.2018
Patent
Optoelectronic modules including optoelectronic device subassemblies and methods of manufacturing the same
LUA, EDMUND KOON, WANG, JI, GUBSER, SIMON, TESANOVIC, BOJAN, LEE, MING JIE, PAING, MYO, YU, QICHUAN, RUDMANN, HARTMUT, LIU, HONGYUAN, TANG, JIAN, YI, XU, ONG, EUNICE HO
Year of Publication 01.05.2018
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Year of Publication 01.05.2018
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