Effects of annealing and current stressing on the intermetallic compounds growth kinetics of Cu/thin Sn/Cu bump
Jeong, Myeong-Hyeok, Kim, Jae-Won, Kwak, Byung-Hyun, Park, Young-Bae
Published in Microelectronic engineering (2012)
Published in Microelectronic engineering (2012)
Get full text
Journal Article
Conference Proceeding
Effects of surface finishes and loading speeds on shear strength of Sn–3.0Ag–0.5Cu solder joints
Kim, Jae-Myeong, Jeong, Myeong-Hyeok, Yoo, Sehoon, Lee, Chang-Woo, Park, Young-Bae
Published in Microelectronic engineering (2012)
Published in Microelectronic engineering (2012)
Get full text
Journal Article
Conference Proceeding
Correlations between interfacial reactions and bonding strengths of Cu/Sn/Cu pillar bump
Kwak, Byung-Hyun, Jeong, Myeong-Hyeok, Kim, Jae-Won, Lee, Byunghoon, Lee, Hoo-Jeong, Park, Young-Bae
Published in Microelectronic engineering (2012)
Published in Microelectronic engineering (2012)
Get full text
Journal Article
Conference Proceeding
Effect of HF & H2SO4 pretreatment on interfacial adhesion energy of Cu―Cu direct bonds
Get full text
Conference Proceeding
Journal Article
3차원 칩 적층을 위한 Cu pillar/Sn-3.5Ag 미세범프 접합부의 금속간화합물 성장거동에 따른 전단강도 평가
곽병현, Byung Hyun Kwak, 정명혁, Myeong Hyeok Jeong, 박영배, Young Bae Park
Published in 대한금속·재료학회지, 50(10) (20.10.2012)
Published in 대한금속·재료학회지, 50(10) (20.10.2012)
Get full text
Journal Article
Interfacial Reaction Effect on Electrical Reliability of Cu Pillar/Sn Bumps
Jeong, Myeong-Hyeok, Lim, Gi-Tae, Kim, Byoung-Joon, Lee, Ki-Wook, Kim, Jae-Dong, Joo, Young-Chang, Park, Young-Bae
Published in Journal of electronic materials (01.11.2010)
Published in Journal of electronic materials (01.11.2010)
Get full text
Journal Article
3차원 적층 패키지를 위한 Cu/thin Sn/Cu 범프구조의 금속간화합물 성장거동분석
박영배, Young Bae Park, 김재원, Jae Won Kim, 김병준, Byoung Joon Kim, 김재동, Jae Dong Kim, 주영창, Young Chang Joo, 이기욱, Ki Wook Lee, 정명혁, Myeong Hyeok Jeong, 곽병현, Byung Hyun Kwak
Published in 대한금속·재료학회지, 49(2) (20.02.2011)
Get full text
Published in 대한금속·재료학회지, 49(2) (20.02.2011)
Journal Article
고온다습처리조건이무전해니켈도금박막과폴리이미드사이의계면접착력에미치는영향
민경진, Kyoung Jin Min, 정명혁, Myeong Hyeok Jeong, 이규환, Kyu Hwan Lee, 정용수, Yong Soo Jeong, 박영배, Young Bae Park
Published in 대한금속재료학회지 (22.10.2009)
Get full text
Published in 대한금속재료학회지 (22.10.2009)
Journal Article
Effects of surface finish conditions on interfacial reaction characteristics and mechanical reliability of novel Sn-1.2Ag-0.7Cu-0.4In solder bump
Jae-Myeong Kim, Byung-Hyun Kwak, Myeong-Hyeok Jeong, Sehoon Yoo, Young-Bae Park
Published in 2012 IEEE 62nd Electronic Components and Technology Conference (01.05.2012)
Published in 2012 IEEE 62nd Electronic Components and Technology Conference (01.05.2012)
Get full text
Conference Proceeding
Comparisons of mechanical reliabilities of Sn-3.0Ag-0.5Cu solder between ENIG and immersion Sn pad finishes
Jae-Myeong Kim, Myeong-Hyeok Jeong, Sang-Hyun Kwon, Sehoon Yoo, Young-Bae Park
Published in 18th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) (01.07.2011)
Published in 18th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) (01.07.2011)
Get full text
Conference Proceeding
Effect of HF & H sub(2)SO sub(4) pretreatment on interfacial adhesion energy of Cu-Cu direct bonds
Kim, Jae-Won, Jeong, Myeong-Hyeok, Park, Young-Bae
Published in Microelectronic engineering (01.01.2012)
Published in Microelectronic engineering (01.01.2012)
Get full text
Journal Article
Interfacial microstructure and mechanical reliability of Cu pillar/Sn-3.5Ag bump for 3D packages
Byung-Hyun Kwak, Jae-Myeong Kim, Myeong-Hyeok Jeong, Kiwook Lee, Jaedong Kim, Young-Bae Park
Published in 2011 IEEE 13th Electronics Packaging Technology Conference (01.12.2011)
Published in 2011 IEEE 13th Electronics Packaging Technology Conference (01.12.2011)
Get full text
Conference Proceeding