Passive Photonic Integrated Circuits Elements Fabricated on a Silicon Nitride Platform
Lelit, Marcin, Słowikowski, Mateusz, Filipiak, Maciej, Juchniewicz, Marcin, Stonio, Bartłomiej, Michalak, Bartosz, Pavłov, Krystian, Myśliwiec, Marcin, Wiśniewski, Piotr, Kaźmierczak, Andrzej, Anders, Krzysztof, Stopiński, Stanisław, Beck, Romuald B, Piramidowicz, Ryszard
Published in Materials (14.02.2022)
Published in Materials (14.02.2022)
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Journal Article
Influence of Ag particle shape on mechanical and thermal properties of TIM joints
Myśliwiec, Marcin, Kisiel, Ryszard, Kruszewski, Mirosław J.
Published in Microelectronics international (27.10.2022)
Published in Microelectronics international (27.10.2022)
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Journal Article
Ion implantation for isolation of AlGaN/GaN HEMTs using C or Al
Taube, Andrzej, Kamińska, Eliana, Kozubal, Maciej, Kaczmarski, Jakub, Wojtasiak, Wojciech, Jasiński, Jakub, Borysiewicz, Michał A., Ekielski, Marek, Juchniewicz, Marcin, Grochowski, Jakub, Myśliwiec, Marcin, Dynowska, Elżbieta, Barcz, Adam, Prystawko, Paweł, Zając, Marcin, Kucharski, Robert, Piotrowska, Anna
Published in Physica status solidi. A, Applications and materials science (01.05.2015)
Published in Physica status solidi. A, Applications and materials science (01.05.2015)
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Journal Article
Capability for Fine Tuning of the Refractive Index Sensing Properties of Long-Period Gratings by Atomic Layer Deposited Al2O3 Overlays
Śmietana, Mateusz, Myśliwiec, Marcin, Mikulic, Predrag, Witkowski, Bartłomiej, Bock, Wojtek
Published in Sensors (Basel, Switzerland) (28.11.2013)
Published in Sensors (Basel, Switzerland) (28.11.2013)
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Journal Article
Examinations of Selected Thermal Properties of Packages of SiC Schottky Diodes
Bisewski, Damian, Myśliwiec, Marcin, Górecki, Krzysztof, Kisiel, Ryszard, Zarębski, Janusz
Published in Metrology and Measurement systems (01.09.2016)
Published in Metrology and Measurement systems (01.09.2016)
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Journal Article
Investigations of mutual thermal coupling between SiC Schottky diodes situated in the common case
Górecki, Krzysztof, Bisewski, Damian, Zarębski, Janusz, Kisiel, Ryszard, Myśliwiec, Marcin
Published in Circuit world (01.01.2017)
Published in Circuit world (01.01.2017)
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Journal Article
Electrical isolation of GaAs and AlGaAs/GaAs Quantum Cascade Lasers by deep hydrogen implantation
Kozubal, Maciej Artur, Szerling, Anna, Kosiel, Kamil, Myśliwiec, Marcin, Pągowska, Karolina, Jakieła, Rafał, Kruszka, Renata, Guziewicz, Marek, Barcz, Adam
Published in Materials science in semiconductor processing (01.02.2018)
Published in Materials science in semiconductor processing (01.02.2018)
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Journal Article
Thermal stability of multilayer Ti2AlN-based ohmic contacts to n-GaN in ambient air
Borysiewicz, Michał A., Myśliwiec, Marcin, Gołaszewska, Krystyna, Jakieła, Rafał, Dynowska, Elżbieta, Kamińska, Eliana, Piotrowska, Anna
Published in Solid-state electronics (01.04.2014)
Published in Solid-state electronics (01.04.2014)
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Journal Article
Application of direct bonded copper substrates for prototyping of power electronic modules
Grzesiak, Wojciech, Maćków, Piotr, Maj, Tomasz, Synkiewicz, Beata, Witek, Krzysztof, Kisiel, Ryszard, Myśliwiec, Marcin, Borecki, Janusz, Serzysko, Tomasz, Żupnik, Marek
Published in Circuit world (01.02.2016)
Published in Circuit world (01.02.2016)
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Journal Article
Thermal Parameters of Monocrystalline GaN Schottky Diodes
Gorecki, Pawel, Gorecki, Krzysztof, Kisiel, Ryszard, Mysliwiec, Marcin
Published in IEEE transactions on electron devices (01.05.2019)
Published in IEEE transactions on electron devices (01.05.2019)
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Journal Article
Compact Alcohol Vapor Sensor based on Zinc Oxide Nano-coating Deposited by Atomic Layer Deposition method on Optical Fiber End-face
Śmietana, Mateusz, Grochowski, Jakub, Myśliwiec, Marcin, Wachnicki, Łukasz, Godlewski, Marek, Witkowski, Bartłomiej S.
Published in Procedia engineering (2012)
Published in Procedia engineering (2012)
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Journal Article
MnO2 ultrathin films deposited by means of magnetron sputtering: Relationships between process conditions, structural properties and performance in transparent supercapacitors
Borysiewicz, Michał A., Wzorek, Marek, Myśliwiec, Marcin, Kaczmarski, Jakub, Ekielski, Marek
Published in Superlattices and microstructures (01.12.2016)
Published in Superlattices and microstructures (01.12.2016)
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Journal Article
Material and technological aspects of high-temperature SiC device packages reliability
Myśliwiec, Marcin, Kisiel, Ryszard, Guziewicz, Marek
Published in Microelectronics international (03.08.2015)
Published in Microelectronics international (03.08.2015)
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Journal Article
Challenges in packaging of IR detectors - technology of elastic electrical connections
My liwiec, Marcin, Lewandowski, Arkadiusz, Wiatr, Wojciech, Weremczuk, Jerzy, Szczepa ski, Zbigniew, Kisiel, Ryszard
Published in IOP conference series. Materials Science and Engineering (21.01.2016)
Published in IOP conference series. Materials Science and Engineering (21.01.2016)
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Journal Article
Die attachment Process Overview for High Power Semiconductors
Mysliwiec, Marcin, Kisiel, Ryszard
Published in 2023 46th International Spring Seminar on Electronics Technology (ISSE) (10.05.2023)
Published in 2023 46th International Spring Seminar on Electronics Technology (ISSE) (10.05.2023)
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Conference Proceeding
Silver micropowders as SiC die attach material for high temperature applications
Kisiel, R., Szczepanski, Z., Firek, P., Grochowski, J., Mysliwiec, M., Guziewicz, M.
Published in 2012 35th International Spring Seminar on Electronics Technology (01.05.2012)
Published in 2012 35th International Spring Seminar on Electronics Technology (01.05.2012)
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Conference Proceeding
Solder joints for flexible connection working at low temperatures
Kisiel, Ryszard, Mysliwiec, Marcin
Published in 2015 38th International Spring Seminar on Electronics Technology (ISSE) (01.05.2015)
Published in 2015 38th International Spring Seminar on Electronics Technology (ISSE) (01.05.2015)
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Conference Proceeding
Die attach by diffusion Sn-Ag-Sn soldering in high temperature electronics applications
Mysliwiec, Marcin, Kisiel, Ryszard, Falat, Tomasz
Published in 2016 39th International Spring Seminar on Electronics Technology (ISSE) (01.05.2016)
Published in 2016 39th International Spring Seminar on Electronics Technology (ISSE) (01.05.2016)
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Conference Proceeding
Influence of Packaging Processes and Temperature on Characteristics of Schottky Diodes Made of SiC
Gorecki, Pawel, Mysliwiec, Marcin, Gorecki, Krzysztof, Kisiel, Ryszard
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.04.2019)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.04.2019)
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Journal Article