Analyzing the Influence of RDL Stack-up on Wafer Warpage in FOWLP through Experimental and Numerical Investigations
Huber, Saskia, Scheibe, Philipp, Mutlu, Sukrucan, Wittler, Olaf, Schneider-Ramelow, Martin
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
Get full text
Conference Proceeding