Search Results - "Murugan, Rajen Manicon" :: K.UTB vyhledávací portál

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패키지 기판 상에 안테나를 갖는 안테나 인 패키지

by MURUGAN RAJEN MANICON, TANG YIGI, KULKARNI MAKARAND RAMKRISHNA, WAN LIANG
Year of Publication 31.08.2023

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부가된 전류 경로를 갖는 홀 효과 센서 패키지

by MURUGAN RAJEN MANICON, CHEN JIE, CHAUDHRY USMAN MAHMOOD, LI MING, LARSON TONY RAY, CHAUHAN SATYENDRA SINGH, TUNCER ENIS, TELLKAMP JOHN PAUL, TANG YIQI
Year of Publication 17.01.2022

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SEMICONDUCTOR DEVICE WITH MULTIPLE DIES

by TANG, YIQI, MURUGAN, RAJEN MANICON
Year of Publication 28.12.2023

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INTERDIGITAL CAPACITOR

by MURUGAN, Rajen Manicon, TANG, Yiqi
Year of Publication 14.12.2023

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PACKAGE SUBSTRATE HAVING INTEGRATED PASSIVE DEVICE(S) BETWEEN LEADS

by Tang, Yiqi, Murugan, Rajen Manicon
Year of Publication 29.06.2023

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ANTENNA-ON-PACKAGE INCLUDING MULTIPLE TYPES OF ANTENNA

by Tang, Yiqi, Murugan, Rajen Manicon
Year of Publication 22.06.2023

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ANTENNA-ON-PACKAGE SYSTEM

by MURUGAN, Rajen Manicon, TANG, Yiqi
Year of Publication 27.04.2023

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FAN-OUT PACKAGE WITH ANTENNA

by Tang, Yiqi, Murugan, Rajen Manicon
Year of Publication 23.03.2023

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Package substrate having integrated passive device(s) between leads

by Tang, Yiqi, Murugan, Rajen Manicon
Year of Publication 07.03.2023

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Antenna-on-package including multiple types of antenna

by Tang, Yiqi, Murugan, Rajen Manicon
Year of Publication 07.03.2023

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FLIP-CHIP ENHANCED QUAD FLAT NO-LEAD ELECTRONIC DEVICE WITH CONDUCTOR BACKED COPLANAR WAVEGUIDE TRANSMISSION LINE FEED IN MULTILEVEL PACKAGE SUBSTRATE

by Tang, Yiqi, Murugan, Rajen Manicon
Year of Publication 09.02.2023

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High-frequency ceramic packages with modified castellation and metal layer architectures

by Tang, Yiqi, Murugan, Rajen Manicon, Jiang, Li
Year of Publication 16.07.2024

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Microelectronic Device Package Including Antenna Horn and Semiconductor Device

by Tang, Yiqi, Murugan, Rajen Manicon
Year of Publication 24.11.2022

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MULTILAYER PACKAGE SUBSTRATE WITH STRESS BUFFER

by Tang, Yiqi, Murugan, Rajen Manicon, Li, Guangxu
Year of Publication 04.04.2024

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SEMICONDUCTOR PACKAGES WITH DIRECTIONAL ANTENNAS

by HERBSOMMER, Juan, MURUGAN, Rajen Manicon, TANG, Yiqi
Year of Publication 04.04.2024

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Ceramic semiconductor package seal rings

by Tang, Yiqi, Murugan, Rajen Manicon, Jiang, Li
Year of Publication 23.01.2024

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Multilayer package substrate with stress buffer

by Tang, Yiqi, Murugan, Rajen Manicon, Li, Guangxu
Year of Publication 10.10.2023

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SEMICONDUCTOR DEVICE WITH A POWER CONVERTER MODULE

by Tang, Yiqi, Murugan, Rajen Manicon
Year of Publication 27.01.2022

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ELECTRONIC DEVICE AND MULTILEVEL PACKAGE SUBSTRATE WITH ELEVATED TRACE FEATURES FOR SOLDER AND/OR DIE CONFINEMENT

by Tang, Yiqi, Murugan, Rajen Manicon, Li, Guangxu
Year of Publication 24.08.2023

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CERAMIC SEMICONDUCTOR PACKAGE SEAL RINGS

by JIANG, Li, MURUGAN, Rajen Manicon, TANG, Yiqi
Year of Publication 22.06.2023

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