Thickness dependent electrical resistivity of ultrathin (<40 nm) Cu films
Liu, H.-D, Zhao, Y.-P, Ramanath, G, Murarka, S.P, Wang, G.-C
Published in Thin solid films (01.03.2001)
Published in Thin solid films (01.03.2001)
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Journal Article
Advanced multilayer metallization schemes with copper as interconnection metal
Murarka, S.P., Gutmann, R.J., Kaloyeros, A.E., Lanford, W.A.
Published in Thin solid films (15.12.1993)
Published in Thin solid films (15.12.1993)
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Journal Article
Conference Proceeding
Pattern Geometry Effects in the Chemical‐Mechanical Polishing of Inlaid Copper Structures
Steigerwald, J. M., Zirpoli, R., Murarka, S. P., Price, D., Gutmann, R. J.
Published in Journal of the Electrochemical Society (01.10.1994)
Published in Journal of the Electrochemical Society (01.10.1994)
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Journal Article
Materials aspects of copper interconnection technology for semiconductor applications
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Journal Article
Book Review
Surface segregation of Al of the bilayers of pure Cu and Cu-Al alloy films
WANG, Pei-I, MURARKA, S. P, KAMINSKI, D. A, BEDELL, S, LANFORD, W. A
Published in Journal of the Electrochemical Society (01.09.2001)
Published in Journal of the Electrochemical Society (01.09.2001)
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Journal Article
Mobile ion detection in organosiloxane polymer using triangular voltage sweep
MALLIKARJUNAN, A, MURARKA, S. P, LU, T.-M
Published in Journal of the Electrochemical Society (01.10.2002)
Published in Journal of the Electrochemical Society (01.10.2002)
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Journal Article
Stability of Cu on Epoxy Siloxane Polymer under Bias Temperature Stress
Wang, Pei-I, Juneja, J. S., Murarka, S. P., Lu, T.-M., Jezewski, C., Ghoshal, Ram, Ghoshal, Rajat, Bakhru, H.
Published in Journal of the Electrochemical Society (01.01.2006)
Published in Journal of the Electrochemical Society (01.01.2006)
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Journal Article
Multilevel interconnections for ULSI and GSI era
Murarka, Shyam P.
Published in Materials science & engineering. R, Reports : a review journal (01.05.1997)
Published in Materials science & engineering. R, Reports : a review journal (01.05.1997)
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Journal Article
Capacitance–voltage, current–voltage, and thermal stability of copper alloyed with aluminium or magnesium
Suwwan de Felipe, T, Murarka, S.P, Bedell, S, Lanford, W.A
Published in Thin solid films (14.12.1998)
Published in Thin solid films (14.12.1998)
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Journal Article
An investigation of slurry chemistry used in chemical mechanical planarization of aluminum
KALLINGAL, C. G, DUQUETTE, D. J, MURARKA, S. P
Published in Journal of the Electrochemical Society (01.06.1998)
Published in Journal of the Electrochemical Society (01.06.1998)
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Journal Article
Copper/benzocyclobutene interconnects for sub-100 nm integrated circuit technology : Elimination of high-resistivity metallic liners and high-dielectric constant polish stops
NEIRYNCK, J. M, GUTMANN, R. J, MURARKA, S. P
Published in Journal of the Electrochemical Society (01.04.1999)
Published in Journal of the Electrochemical Society (01.04.1999)
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Journal Article
Effect of copper ions in the slurry on the chemical-mechanical polish rate of titanium
STEIGERWALD, J. M, MURARKA, S. P, GUTMANN, R. J, DUQUETTE, D. J
Published in Journal of the Electrochemical Society (01.12.1994)
Published in Journal of the Electrochemical Society (01.12.1994)
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Journal Article
Passivation of copper by silicide formation in dilute silane
HYMES, S, MURARKA, S. P, SHEPARD, C, LANFORD, W. A
Published in Journal of applied physics (01.05.1992)
Published in Journal of applied physics (01.05.1992)
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Journal Article
Electrical behavior of Cu thin fluorinated PECVD oxide MIS capacitors
MALLIKARJUNAN, A, MURARKA, S. P, STEINBRUCHEL, C, KUMAR, A, BAKHRU, H
Published in Journal of the Electrochemical Society (01.09.2000)
Published in Journal of the Electrochemical Society (01.09.2000)
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Journal Article
Annealing of boron-implanted corrosion resistant copper films
DING, P. J, LANFORD, W. A, HYMES, S, MURARKA, S. P
Published in Journal of applied physics (15.07.1993)
Published in Journal of applied physics (15.07.1993)
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Journal Article