Kinetic Velocity Model to Account for Ballistic Effects in the Drift-Diffusion Transport Approach
Penzin, Oleg, Smith, Lee, Erlebach, Axel, Munkang Choi, Ko-Hsin Lee
Published in IEEE transactions on electron devices (01.11.2017)
Published in IEEE transactions on electron devices (01.11.2017)
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Journal Article
Comparative Analysis of Semiconductor Device Architectures for 5-nm Node and Beyond
Peijie Feng, Seung-Chul Song, Nallapati, Giri, Zhu, John, Bao, Jerry, Moroz, Victor, Munkang Choi, Xi-Wei Lin, Qiang Lu, Colombeau, Benjamin, Breil, Nicolas, Chudzik, Michael, Chidambaram, Chidi
Published in IEEE electron device letters (01.12.2017)
Published in IEEE electron device letters (01.12.2017)
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Journal Article
Extending drift-diffusion paradigm into the era of FinFETs and nanowires
Munkang Choi, Moroz, Victor, Smith, Lee, Huang, Joanne
Published in 2015 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) (01.09.2015)
Published in 2015 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) (01.09.2015)
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Conference Proceeding
Journal Article
Effectiveness of Stressors in Aggressively Scaled FinFETs
Nuo Xu, Ho, B., Munkang Choi, Moroz, V., Liu, Tsu-Jae King
Published in IEEE transactions on electron devices (01.06.2012)
Published in IEEE transactions on electron devices (01.06.2012)
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Journal Article
Diagnosis of Optical Lithography Faults With Product Test Sets
Munkang Choi, Milor, L.
Published in IEEE transactions on computer-aided design of integrated circuits and systems (01.09.2008)
Published in IEEE transactions on computer-aided design of integrated circuits and systems (01.09.2008)
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Journal Article
FinFET to nanowire transition at 5nm design rules
Smith, Lee, Munkang Choi, Frey, Martin, Moroz, Victor, Ziegler, Anne, Luisier, Mathieu
Published in 2015 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) (01.09.2015)
Published in 2015 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) (01.09.2015)
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Conference Proceeding
Journal Article
FinFET/nanowire design for 5nm/3nm technology nodes: Channel cladding and introducing a "bottleneck" shape to remove performance bottleneck
Moroz, Victor, Huang, Joanne, Munkang Choi
Published in 2017 IEEE Electron Devices Technology and Manufacturing Conference (EDTM) (01.02.2017)
Published in 2017 IEEE Electron Devices Technology and Manufacturing Conference (EDTM) (01.02.2017)
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Conference Proceeding
Study of Area Scaling Effect on Integrated Circuit Reliability Based on Yield Models
Hong, Changsoo, Milor, Linda, Choi, Munkang, Lin, Tom
Published in Microelectronics and reliability (01.09.2005)
Published in Microelectronics and reliability (01.09.2005)
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Journal Article
Conference Proceeding
Effectiveness of strained-Si technology for thin-body MOSFETs
Nuo Xu, Changhwan Shin, Andrieu, F., Ho, B., Wade Xiong, Weber, O., Poiroux, T., Bich-Yen Nguyen, Munkang Choi, Moroz, V., Faynot, O., Tsu-Jae King Liu
Published in 2012 IEEE International SOI Conference (SOI) (01.10.2012)
Published in 2012 IEEE International SOI Conference (SOI) (01.10.2012)
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Conference Proceeding
A 3-D TCAD Framework for NBTI-Part I: Implementation Details and FinFET Channel Material Impact
Tiwari, Ravi, Parihar, Narendra, Thakor, Karansingh, Wong, Hiu Yung, Motzny, Steve, Choi, Munkang, Moroz, Victor, Mahapatra, Souvik
Published in IEEE transactions on electron devices (01.05.2019)
Published in IEEE transactions on electron devices (01.05.2019)
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Journal Article
A 3-D TCAD Framework for NBTI, Part-II: Impact of Mechanical Strain, Quantum Effects, and FinFET Dimension Scaling
Tiwari, Ravi, Parihar, Narendra, Thakor, Karansingh, Wong, Hiu Yung, Motzny, Steve, Choi, Munkang, Moroz, Victor, Mahapatra, Souvik
Published in IEEE transactions on electron devices (01.05.2019)
Published in IEEE transactions on electron devices (01.05.2019)
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Journal Article
Exploring Power Savings of Gate-All-Around Cryogenic Technology
Moroz, Victor, Svizhenko, Alexei, Choi, Munkang, Asenov, Plamen, Lee, Jaehyun
Published in 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) (11.06.2023)
Published in 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) (11.06.2023)
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Conference Proceeding
Modeling Performance and Thermal Induced Reliability Issues of a 3nm FinFET Logic Chip Operation in a Fan-Out and a Flip-Chip Packages
Choi, Munkang, Xu, Xiaopeng, Moroz, Victor
Published in 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (01.05.2019)
Published in 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (01.05.2019)
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Conference Proceeding
14 nm FinFET Stress Engineering with Epitaxial SiGe Source/Drain
Munkang Choi, Moroz, V., Smith, L., Penzin, O.
Published in 2012 International Silicon-Germanium Technology and Device Meeting (ISTDM) (01.06.2012)
Published in 2012 International Silicon-Germanium Technology and Device Meeting (ISTDM) (01.06.2012)
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Conference Proceeding
The Impact of Defects on GaN Device Behavior: Modeling Dislocations, Traps, and Pits
Moroz, Victor, Wong, Hiu Yung, Choi, Munkang, Braga, Nelson, Mickevicius, R. V., Zhang, Yuhao, Palacios, Thomas
Published in ECS journal of solid state science and technology (01.01.2016)
Published in ECS journal of solid state science and technology (01.01.2016)
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Journal Article
Modeling and optimization of group IV and III-V FinFETs and nano-wires
Moroz, Victor, Smith, Lee, Huang, Joanne, Munkang Choi, Ma, Terry, Jie Liu, Yunqiang Zhang, Xi-Wei Lin, Kawa, Jamil, Saad, Yves
Published in 2014 IEEE International Electron Devices Meeting (01.12.2014)
Published in 2014 IEEE International Electron Devices Meeting (01.12.2014)
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Conference Proceeding