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Temperature-Aware Sizing of Multi-Chip Module Accelerators for Multi-DNN Workloads
Shukla, Prachi, Aguren, Derrick, Burd, Tom, Coskun, Ayse K., Kalamatianos, John
Published in Proceedings - Design, Automation, and Test in Europe Conference and Exhibition (01.04.2023)
Published in Proceedings - Design, Automation, and Test in Europe Conference and Exhibition (01.04.2023)
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Conference Proceeding
Multi-chip module package compact thermal models
Year of Publication 10.09.2019
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Patent
Multi-chip module package compact thermal models
Kulkarni, Aniket A, Yaddanapudi, Vamsi Krishna, Nagulapally, Manoj, Adhiya, Ankit R
Year of Publication 10.09.2019
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Year of Publication 10.09.2019
Patent