Cost-efficient in-situ end-of-life prognostics of power dies and LEDs by junction temperature measurement
Sheva, Sergey, Mrossko, Raul, Heilmann, Jens, Wunderle, Bernhard, Hantos, Gusztav, Noijen, Sander, Keller, Jurgen
Published in 2016 22nd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) (01.09.2016)
Published in 2016 22nd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) (01.09.2016)
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Conference Proceeding
Application of numerical optimization algorithms used to investigation of thin films in nanoindentation test
Dowhan, Lukasz, Wymyslowski, Artur, Wittler, Olaf, Mrossko, Raul
Published in 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2010)
Published in 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2010)
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Conference Proceeding
Mechanical characterisation of thin metal layers by modelling of the nanoindentation experiment
Wittler, O., Mrossko, R., Kaulfersch, E., Wunderle, B., Michel, B.
Published in 2008 2nd Electronics System-Integration Technology Conference (01.09.2008)
Published in 2008 2nd Electronics System-Integration Technology Conference (01.09.2008)
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Conference Proceeding
Dual-side heat removal by micro-channel cold plate and silicon-interposer with embedded fluid channels
Brunschwiler, Thomas, Mrossko, Raul, Keller, Jurgen, Ozsun, Ozgur, Schlottig, Gerd
Published in 2016 6th Electronic System-Integration Technology Conference (ESTC) (01.09.2016)
Published in 2016 6th Electronic System-Integration Technology Conference (ESTC) (01.09.2016)
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Conference Proceeding
Thermal design of a high current circuit board for automotive applications
Mrossko, Raul, Neeb, Christoph, Hofmann, Thomas, Neumann, Alexander, Keller, Jurgen
Published in 19th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) (01.09.2013)
Published in 19th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) (01.09.2013)
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Conference Proceeding