μ-Raman spectroscopy for stress analysis in high power silicon devices
Kociniewski, T., Moussodji, J., Khatir, Z.
Published in Microelectronics and reliability (01.09.2014)
Published in Microelectronics and reliability (01.09.2014)
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Journal Article
Conference Proceeding
Distributed electro-thermal model of IGBT chip – Application to top-metal ageing effects in short circuit conditions
Moussodji, J., Kociniewski, T., Khatir, Z.
Published in Microelectronics and reliability (01.09.2013)
Published in Microelectronics and reliability (01.09.2013)
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Journal Article
Conference Proceeding
New Investigation Possibilities on Forward Biased Power Devices Using Cross Sections
Kociniewski, T., Moussodji, J., Khatir, Z., Berkani, M., Lefebvre, S., Azzopardi, S.
Published in IEEE electron device letters (01.04.2012)
Published in IEEE electron device letters (01.04.2012)
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Journal Article
Warpage Control During Mass Reflow Flip Chip Assembly Using Temporary Adhesive Bonding
Goodhue, Normand-Pierre, Danovitch, David, Moussodji Moussodji, Jeff, Papineau, Benoit, Duchesne, Eric
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
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Conference Proceeding