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Through Silicon Via Aware Design Planning for Thermally Efficient 3-D Integrated Circuits
by
Yibo Chen
,
Kursun, Eren
,
Motschman
,
Dave
,
Johnson, Charles
,
Yuan Xie
Published in
IEEE transactions on computer-aided design of integrated circuits and systems
(01.09.2013)
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Analysis and mitigation of lateral thermal blockage effect of through-silicon-via in 3D IC designs
by
Yibo Chen
,
Kursun, Eren
,
Motschman
,
Dave
,
Johnson, Charles
,
Yuan Xie
Published in
IEEE/ACM International Symposium on Low Power Electronics and Design
(01.08.2011)
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engineering
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computer science
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conductivity
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heating
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optimization
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silicon
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thermal conductivity
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through-silicon vias
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IEEE Electronic Library (IEL)
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