Micro-reactor mixing unit interspacing for fast liquid-liquid reactions leading to a generalized scale-up methodology
Mielke, Eric, Plouffe, Patrick, Mongeon, Sébastien S., Aellig, Christof, Filliger, Sarah, Macchi, Arturo, Roberge, Dominique M.
Published in Chemical engineering journal (Lausanne, Switzerland : 1996) (15.11.2018)
Published in Chemical engineering journal (Lausanne, Switzerland : 1996) (15.11.2018)
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Self-aligned metal capping layers for copper interconnects using electroless plating
Gambino, J., Wynne, J., Gill, J., Mongeon, S., Meatyard, D., Lee, B., Bamnolker, H., Hall, L., Li, N., Hernandez, M., Little, P., Hamed, M., Ivanov, I., Gan, C.L.
Published in Microelectronic engineering (01.11.2006)
Published in Microelectronic engineering (01.11.2006)
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Examining the sensitivity of an injury surveillance program using population-based estimates
Macpherson, A K, White, H L, Mongeon, S, Grant, V J, Osmond, M, Lipskie, T, Mackay, M J
Published in Injury prevention (01.08.2008)
Published in Injury prevention (01.08.2008)
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Critical ultra low-k TDDB reliability issues for advanced CMOS technologies
Chen, F., Shinosky, M., Li, B., Gambino, J., Mongeon, S., Pokrinchak, P., Aitken, J., Badami, D., Angyal, M., Achanta, R., Bonilla, G., Yang, G., Liu, P., Li, K., Sudijono, J., Tan, Y., Tang, T.J., Child, C.
Published in 2009 IEEE International Reliability Physics Symposium (01.01.2009)
Published in 2009 IEEE International Reliability Physics Symposium (01.01.2009)
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Conference Proceeding
Initial stages of growth of heteroepitaxial yttria-stabilized zirconia films on silicon substrates
BUNT, P, VARHUE, W. J, ADAMS, E, MONGEON, S
Published in Journal of the Electrochemical Society (01.12.2000)
Published in Journal of the Electrochemical Society (01.12.2000)
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Journal Article
Effect of CoWP cap thickness on via yield and reliability for Cu interconnects with CoWP-only cap process
Gambino, J., Wynne, J., Smith, S., Mongeon, S., Pokrinchak, P., Meatyard, D.
Published in Proceedings of the IEEE 2005 International Interconnect Technology Conference, 2005 (2005)
Published in Proceedings of the IEEE 2005 International Interconnect Technology Conference, 2005 (2005)
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Conference Proceeding
Stress migration lifetime for Cu interconnects with CoWP-only cap
Gambino, J., Johnson, C., Therrien, J., Hunt, D., Wynne, J., Smith, S., Mongeon, S., Pokrinchak, P., Levin, T.M.
Published in Proceedings of the 12th International Symposium on the Physical and Failure Analysis of Integrated Circuits, 2005. IPFA 2005 (2005)
Published in Proceedings of the 12th International Symposium on the Physical and Failure Analysis of Integrated Circuits, 2005. IPFA 2005 (2005)
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Conference Proceeding
Growth of heteroepitaxial GaSb thin films on Si(100) substrates
Nguyen, Thang, Varhue, Walter, Adams, Edward, Lavoie, Mark, Mongeon, Stephen
Published in Journal of materials research (01.08.2004)
Published in Journal of materials research (01.08.2004)
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Journal Article
Electrically Programmable Fuses for Analog and Mixed Signal Applications in Silicon Germanium BiCMOS Technologies
Gebreselasie, E.G., Voldman, S.H., He, Z. X., Coolbaugh, D., Rassel, R.M., Kirihata, T., Paganini, A., Cox, C.G., Mongeon, S.A., St. Onge, S.A., Dunn, J.S., Halbach, R.E., Lukaitis, J.M.
Published in 2007 IEEE Bipolar/BiCMOS Circuits and Technology Meeting (01.09.2007)
Published in 2007 IEEE Bipolar/BiCMOS Circuits and Technology Meeting (01.09.2007)
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Conference Proceeding
CMOS Imager with Copper Wiring and Lightpipe
Gambino, J., Leidy, B., Adkisson, J., Jaffe, M., Rassel, R.J., Wynne, J., Ellis-Monaghan, J., Hoague, T., Meatyard, D., Mongeon, S., Kryzak, T.
Published in 2006 International Electron Devices Meeting (01.12.2006)
Published in 2006 International Electron Devices Meeting (01.12.2006)
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Conference Proceeding
Reliability of Cu Interconnects with Ta Implant
Gambino, J., Sullivan, T.D., Chen, F., Gill, J., Mongeon, S., Adams, E., Burnham, J., Rodbell, K.
Published in 2007 IEEE International Interconnect Technology Conferencee (01.06.2007)
Published in 2007 IEEE International Interconnect Technology Conferencee (01.06.2007)
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Conference Proceeding
Yield and Reliability of Cu Capped with CoWP using a Self-Activated Process
Gambino, J., Wynne, J., Gill, J., Mongeon, S., Meatyard, D., Bamnolker, H., Hall, L., Li, N., Hernandez, M., Little, P., Hamed, M., Ivanov, I.
Published in 2006 International Interconnect Technology Conference (2006)
Published in 2006 International Interconnect Technology Conference (2006)
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Conference Proceeding
Effect of CoWP Capping Layers on Dielectric Breakdown of SiO2
Gambino, J., Fen Chen, Mongeon, S., Meatyard, D., Lee, T., Lee, B., Bamnolker, H., Hall, L., Li, N., Hernandez, M., Little, P., Hamed, M., Ivanov, I.
Published in 2007 14th International Symposium on the Physical and Failure Analysis of Integrated Circuits (01.07.2007)
Published in 2007 14th International Symposium on the Physical and Failure Analysis of Integrated Circuits (01.07.2007)
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Conference Proceeding
Yield improvement for a 3.5-ns BiCMOS technology in a 200-mm manufacturing line
Chen, B., Hook, T., Starkey, G., Bhattacharyya, A., Faucher, M., Racine, C., Willets, C., Eslinger, S., Kulkarni, S., King, W., Washburn, C., Piccirillo, J., Mongeon, S., Johnson, A., Gabrielle, E.
Published in 1993 International Symposium on VLSI Technology, Systems, and Applications Proceedings of Technical Papers (1993)
Published in 1993 International Symposium on VLSI Technology, Systems, and Applications Proceedings of Technical Papers (1993)
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Conference Proceeding
Optimization of a High-Volume 200-mm BiCMOS Manufacturing Line
Hook, T., Chen, B., Starkey, G., Bhattacharyya, A., Faucher, M., Racine, C., Willets, C., Eslinger, S., Kulkarni, S., King, W., Washburn, C., Piccirillo, J., Mongeon, S., Johnson, A., Gabrielle, E.
Published in Proceedings. IEEE/SEMI Advanced Semiconductor Manufacturing Conference and Workshop (1993)
Published in Proceedings. IEEE/SEMI Advanced Semiconductor Manufacturing Conference and Workshop (1993)
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Conference Proceeding
Stress migration lifetime for Cu interconnects with CoWP-only cap
Gambino, J.P., Johnson, C.L., Therrien, J.E., Hunt, D.B., Wynne, J.E., Smith, S., Mongeon, S.A., Pokrinchak, D.P., Levin, T.M.
Published in IEEE transactions on device and materials reliability (01.06.2006)
Published in IEEE transactions on device and materials reliability (01.06.2006)
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