Decomposition mechanism and morphological evolution of realized Cu nanoparticles in Cu complex inks
Mohan, Nihesh, Ahuir-Torres, Juan Ignacio, Bhogaraju, Sri Krishna, Webler, Ralf, Kotadia, Hiren R, Erdogan, Huseyin, Elger, Gordon
Published in New journal of chemistry (15.04.2024)
Published in New journal of chemistry (15.04.2024)
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Journal Article
Decomposition mechanism and morphological evolution of in situ realized Cu nanoparticles in Cu complex inks
Mohan, Nihesh, Ahuir-Torres, Juan Ignacio, Bhogaraju, Sri Krishna, Webler, Ralf, Kotadia, Hiren R., Erdogan, Huseyin, Elger, Gordon
Published in New journal of chemistry (15.04.2024)
Published in New journal of chemistry (15.04.2024)
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Journal Article
Low Temperature Die-Attach Bonding Using Copper Particle Free Inks
Steinberger, Fabian, Mohan, Nihesh, Ramer, Olaf, Elger, Gordon
Published in 2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC) (11.09.2024)
Published in 2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC) (11.09.2024)
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Conference Proceeding
Fluxfree solder paste and process for standard SMD components
Mohan, Nihesh, Langer, Stefan, Elger, Gordon
Published in 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC) (13.09.2022)
Published in 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC) (13.09.2022)
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Conference Proceeding
Rapid Sintering of Inkjet Printed Cu Complex Inks Using Laser in Air
Mohan, Nihesh, Ahuir-Torres, Juan Ignacio, Bhogaraju, Sri Krishna, Kotadia, Hiren, Elger, Gordon
Published in 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC) (11.09.2023)
Published in 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC) (11.09.2023)
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Conference Proceeding
Novel Low Temperature and Low Pressure Sintering of ADAS Radar Sensor Antenna Stack
Bhogaraju, Sri Krishna, Mohan, Nihesh, Steinberger, Fabian, Erdogan, Hueseyin, Hadrava, Philipp, Elger, Gordon
Published in 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC) (11.09.2023)
Published in 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC) (11.09.2023)
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Conference Proceeding
COPPER-CONTAINING METAL FOIL AND METHOD FOR PRODUCING A COPPER-CONTAINING METAL FOIL
MOHAN, Nihesh, SACCON, Rodolfo, BHOGARAJU, Sri Krishna, ELGER, Gordon
Year of Publication 22.08.2024
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Year of Publication 22.08.2024
Patent
Drop feature optimization for fine trace inkjet printing
Mohan, Nihesh, Bhogaraju, Sri Krishna, Lysien, Mateusz, Schneider, Ludovic, Granek, Filip, Lux, Kerstin, Elger, Gordon
Published in 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC) (13.09.2021)
Published in 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC) (13.09.2021)
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Conference Proceeding