Superconformal Nickel Deposition in Through Silicon Vias: Experiment and Prediction
Braun, T. M., Kim, S.-H., Lee, H.-J., Moffat, T. P., Josell, D.
Published in Journal of the Electrochemical Society (01.01.2018)
Published in Journal of the Electrochemical Society (01.01.2018)
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Curvature enhanced adsorbate coverage mechanism for bottom-up superfilling and bump control in damascene processing
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Conference Proceeding
Modeling Superconformal electrodeposition using the level set method
WHEELER, D, JOSELL, D, MOFFAT, T. P
Published in Journal of the Electrochemical Society (01.05.2003)
Published in Journal of the Electrochemical Society (01.05.2003)
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Journal Article
Curvature Enhanced Adsorbate Coverage Model for Electrodeposition
Moffat, T. P., Wheeler, D., Kim, S.-K., Josell, D.
Published in Journal of the Electrochemical Society (2006)
Published in Journal of the Electrochemical Society (2006)
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Journal Article
Simulation of Copper Electrodeposition in Through-Hole Vias
Braun, T M, Josell, D, John, J, Moffat, T P
Published in Journal of the Electrochemical Society (2020)
Published in Journal of the Electrochemical Society (2020)
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Journal Article
Mechanism of Bismuth Stimulated Bottom-up Gold Feature Filling
Josell, D., Braun, T. M., Moffat, T. P.
Published in Journal of the Electrochemical Society (01.12.2022)
Published in Journal of the Electrochemical Society (01.12.2022)
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Journal Article
Electrodeposition of Cu on Ru Barrier Layers for Damascene Processing
Moffat, T. P., Walker, M., Chen, P. J., Bonevich, J. E., Egelhoff, W. F., Richter, L., Witt, C., Aaltonen, T., Ritala, M., Leskelä, M., Josell, D.
Published in Journal of the Electrochemical Society (2006)
Published in Journal of the Electrochemical Society (2006)
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Journal Article
Spatial-Temporal Modeling of Extreme Bottom-up Filling of Through-Silicon-Vias
Wheeler, D., Moffat, T. P., Josell, D.
Published in Journal of the Electrochemical Society (01.01.2013)
Published in Journal of the Electrochemical Society (01.01.2013)
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Journal Article
Effect of Chloride Concentration on Copper Deposition in Through Silicon Vias
Braun, T. M., Josell, D., Silva, M., Kildon, J., Moffat, T. P.
Published in Journal of the Electrochemical Society (2019)
Published in Journal of the Electrochemical Society (2019)
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Journal Article