Search Results - "Miura, Muneo" :: K.UTB vyhledávací portál

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METHOD OF MANUFACTURING ELECTRONIC COMPONENT PACKAGE

by OKADA HIROKAZU, MIURA MUNEO
Year of Publication 01.02.2018

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Patent

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METHOD FOR MANUFACTURING ELECTRONIC COMPONENT PACKAGE

by OKADA HIROKAZU, MIURA MUNEO
Year of Publication 12.04.2017

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Patent

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METHOD OF MANUFACTURING ELECTRONIC COMPONENT PACKAGE

by OKADA HIROKAZU, MIURA MUNEO
Year of Publication 08.02.2016

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Patent

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METHOD FOR MANUFACTURING ELECTRONIC COMPONENT PACKAGE

by OKADA HIROKAZU, MIURA MUNEO
Year of Publication 27.01.2016

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Patent

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MANUFACTURING METHOD OF RESIN-SEALED ELECTRONIC COMPONENT, TABULAR MEMBER WITH BUMP ELECTRODE, RESIN-SEALED ELECTRONIC COMPONENT, AND MANUFACTURING METHOD OF TABULAR MEMBER WITH BUMP ELECTRODE

by AMAKAWA TAKESHI, OKADA HIROKAZU, MIURA MUNEO, URAGAMI HIROSHI
Year of Publication 08.02.2016

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Patent

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METHOD FOR PRODUCING ELECTRONIC COMPONENT, BUMP-FORMED PLATE-LIKE MEMBER, ELECTRONIC COMPONENT, AND METHOD FOR PRODUCING BUMP-FORMED PLATE-LIKE MEMBER

by AMAKAWA TSUYOSHI, OKADA HIROKAZU, MIURA MUNEO, URAGAMI HIROSHI
Year of Publication 27.01.2016

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Patent

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METHOD OF MANUFACTURING RESIN SEALED ELECTRONIC COMPONENT, PLANAR MEMBER WITH BUMP ELECTRODE, AND RESIN SEALED ELECTRONIC COMPONENT

by AMAKAWA TAKESHI, OKADA HIROKAZU, MIURA MUNEO, URAGAMI HIROSHI
Year of Publication 24.11.2015

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Patent

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METHOD FOR PRODUCING RESIN-ENCAPSULATED ELECTRONIC COMPONENT, BUMP-FORMED PLATE-LIKE MEMBER, RESIN-ENCAPSULATED ELECTRONIC COMPONENT, AND METHOD FOR PRODUCING BUMP-FORMED PLATE-LIKE MEMBER

by AMAKAWA TSUYOSHI, OKADA HIROKAZU, MIURA MUNEO, URAGAMI HIROSHI
Year of Publication 03.11.2015

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Patent

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Compression Molding solutions for various high end package and cost savings for standard package applications

by Miura, Muneo
Published in 2016 International Conference on Electronics Packaging (ICEP) (01.04.2016)

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Conference Proceeding

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Method for manufacturing electronic component package

by MIURA, MUNEO, OKADA, HIROKAZU
Year of Publication 10.02.2016

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Patent

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Method for manufacturing electronic component package

by MIURA, MUNEO, OKADA, HIROKAZU
Year of Publication 11.12.2018

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Patent

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METHOD OF MANUFACTURING ELECTRONIC COMPONENT PACKAGE

by OKADA HIROKAZU, MIURA MUNEO
Year of Publication 07.12.2018

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Patent

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RESIN SEALING APPARATUS AND RESIN SEALING METHOD

by MIURA MUNEO
Year of Publication 12.05.2006

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Patent

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Method for producing resin-encapsulated electronic component, bump-formed plate-like member, resin-encapsulated electronic component, and method for producing bump-formed plate-like member

by Amakawa Tsuyoshi, Okada Hirokazu, Uragami Hiroshi, Miura Muneo
Year of Publication 08.08.2017

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Patent

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Method for manufacturing electronic component package

by MIURA, MUNEO, OKADA, HIROKAZU
Year of Publication 01.06.2017

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Patent

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Resin sealing apparatus and resin sealing method

by MIURA, MUNEO
Year of Publication 21.04.2006

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Patent

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Method for manufacturing electronic component package

by MIURA, MUNEO, OKADA, HIROKAZU
Year of Publication 01.04.2017

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Patent

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RESIN SEALING APPARATUS AND RESIN SEALING METHOD

by MUNEO MIURA
Year of Publication 28.10.2005

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Patent

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RESIN SEAL DEVICE AND RESIN SEAL METHOD

by MIURA MUNEO
Year of Publication 22.09.2005

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Patent

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Resin sealing device and method

by MIURA MUNEO
Year of Publication 14.09.2005

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Patent

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