by MIRGKIZOUDI, M, LIU, C, CONWAY, P. P, RICHES, S
Published in Journal of microelectronics and electronic packaging (01.04.2013)

by Mirgkizoudi, M., Liu, C., Conway, P.P., Riches, S.
Published in Microelectronics and reliability (01.05.2015)

by Hinton, J., Mirgkizoudi, M., Campos-Zatarain, A., Flynn, D., Harris, R.A., Kay, R.W.
Published in 2018 7th Electronic System-Integration Technology Conference (ESTC) (01.09.2018)

by Kamaludin, K. A., Mirgkizoudi, M., Liu, C., Riches, S.
Published in 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging (01.08.2011)

by Campos-Zatarain, A., Flynn, D., Aasmundtveit, K. E., Hoivik, N., Wang, K., Liu, H., Luu, T. T., Mirgkizoudi, M., Kay, R. W.
Published in 2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) (01.04.2014)

by Mirgkizoudi, M, Changqing Liu, Riches, S
Published in 2010 12th Electronics Packaging Technology Conference (01.12.2010)