Reliability assessment of hafnia-based ferroelectric devices and arrays for memory and AI applications (Invited)
Grenouillet, L., Barbot, J., Laguerre, J., Martin, S., Carabasse, C., Louro, M., Bedjaoui, M., Minoret, S., Kerdiles, S., Boixaderas, C., Magis, T., Jahan, C., Andrieu, F., Coignus, J.
Published in 2023 IEEE International Reliability Physics Symposium (IRPS) (01.03.2023)
Published in 2023 IEEE International Reliability Physics Symposium (IRPS) (01.03.2023)
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Conference Proceeding
Investigations of titanium nitride as metal gate material, elaborated by metal organic atomic layer deposition using TDMAT and NH3
FILLOT, F, MOREL, T, MINORET, S, MATKO, I, MAITREJEAN, S, GUILLAUMOT, B, CHENEVIER, B, BILLON, T
Published in Microelectronic engineering (01.12.2005)
Published in Microelectronic engineering (01.12.2005)
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Conference Proceeding
Journal Article
Properties of innovative resistive memories studied by X-ray and UV photoemission
Martinez, E., Guedj, C., Calka, P., Minoret, S., Buckley, J., Bernard, Y., Jousseaume, V.
Published in Surface and interface analysis (01.06.2010)
Published in Surface and interface analysis (01.06.2010)
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Journal Article
Understanding of the thermal stability of the hafnium oxide/TiN stack via 2 “high k” and 2 metal deposition techniques
Cosnier, V., Besson, P., Loup, V., Vandroux, L., Minoret, S., Cassé, M., Garros, X., Pedini, J-M., Lhostis, S., Dabertrand, K., Morin, C., Wiemer, C., Perego, M., Fanciulli, M.
Published in Microelectronic engineering (01.09.2007)
Published in Microelectronic engineering (01.09.2007)
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Journal Article
Conference Proceeding
Through Silicon Via technology using tungsten metallization
Pares, G, Bresson, N, Minoret, S, Lapras, V, Brianceau, P, Lugand, J F, Anciant, R, Sillon, N
Published in 2011 IEEE International Conference on IC Design & Technology (01.05.2011)
Published in 2011 IEEE International Conference on IC Design & Technology (01.05.2011)
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Conference Proceeding
TaN thin film study for Superconducting BEOL integration
Segaud, R., Chene, T., Gergaud, P., Minoret, S., Gustavo, F., Garrione, J., Royer, A., Nemouchi, F.
Published in 2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM) (01.05.2023)
Published in 2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM) (01.05.2023)
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Conference Proceeding
Investigations at low temperature of 90 nm pitch BEOL for quantum applications
Segaud, R., Gergaud, P., Minoret, S., Neumann, P., Gustavo, F., Royer, A., Licitra, C., Mariolle, D., Nemouchi, F.
Published in 2022 IEEE International Interconnect Technology Conference (IITC) (27.06.2022)
Published in 2022 IEEE International Interconnect Technology Conference (IITC) (27.06.2022)
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Conference Proceeding
6.6W/mm 200mm CMOS compatible AlN/GaN/Si MIS-HEMT with in-situ SiN gate dielectric and low temperature ohmic contacts
Morvan, E., Gobil, Y., Morisot, F., Biscarat, J., Charles, M., Lugo, J., Divay, A., Medbouhi, M., Charlet, I., Delprato, J., Scheiblin, P., Rrustemi, B., Giry, A., Serhan, A., Ruel, S., Pimenta-Barros, P., Laulagnet, F., Minoret, S., Anotta, A., Billon, T., Duriez, B.
Published in 2023 International Electron Devices Meeting (IEDM) (09.12.2023)
Published in 2023 International Electron Devices Meeting (IEDM) (09.12.2023)
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Conference Proceeding
Metallic nano-crystals for flash memories
Dufourcq, J., Mur, P., Gordon, M.J., Minoret, S., Coppard, R., Baron, T.
Published in Materials Science & Engineering C (01.09.2007)
Published in Materials Science & Engineering C (01.09.2007)
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Journal Article
Conformal isolation of high-aspect-ratio TSVs using a low-κ dielectric deposited by filament-assisted CVD
Jousseaume, V., Altemus, B., Ribière, C., Minoret, S., Gottardi, M., Ratin, C., Ichiki, K., Mourier, T., Faguet, J.
Published in Microelectronic engineering (05.01.2017)
Published in Microelectronic engineering (05.01.2017)
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Journal Article
Conformal isolation of high-aspect-ratio TSVs using a low-? dielectric deposited by filament-assisted CVD
Jousseaume, V, Altemus, B, Ribière, C, Minoret, S, Gottardi, M, Ratin, C, Ichiki, K, Mourier, T, Faguet, J
Published in Microelectronic engineering (05.01.2017)
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Published in Microelectronic engineering (05.01.2017)
Journal Article
Comparative study of non-polar switching behaviors of NiO- and HfO 2-based oxide resistive-RAMs
Jousseaume, V., Fantini, A., Nodin, J.F., Guedj, C., Persico, A., Buckley, J., Tirano, S., Lorenzi, P., Vignon, R., Feldis, H., Minoret, S., Grampeix, H., Roule, A., Favier, S., Martinez, E., Calka, P., Rochat, N., Auvert, G., Barnes, J.P., Gonon, P., Vallée, C., Perniola, L., De Salvo, B.
Published in Solid-state electronics (01.04.2011)
Published in Solid-state electronics (01.04.2011)
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Journal Article
Comparative study of non-polar switching behaviors of NiO- and HfO2-based oxide resistive-RAMs
Jousseaume, V., Fantini, A., Nodin, J.F., Guedj, C., Persico, A., Buckley, J., Tirano, S., Lorenzi, P., Vignon, R., Feldis, H., Minoret, S., Grampeix, H., Roule, A., Favier, S., Martinez, E., Calka, P., Rochat, N., Auvert, G., Barnes, J.P., Gonon, P., Vallée, C., Perniola, L., De Salvo, B.
Published in Solid-state electronics (01.04.2011)
Published in Solid-state electronics (01.04.2011)
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Journal Article
Analysis of High Aspect Ratio through Silicon via (TSV) Diffusion and Stress Impact Profile during 3D Advanced Integration
Djomeni, Larissa, Mourier, Thierry, Minoret, Stéphane, Fadloun, Sabrina, Barnes, Jean-Paul, Rouchon, Denis, Burgess, Steve, Price, Andrew, Vandroux, Laurent, Mathiot, Daniel
Published in ECS transactions (26.03.2014)
Published in ECS transactions (26.03.2014)
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Journal Article
Comparative study of non-polar switching behaviors of NiO- and HfO sub(2-based oxide resistive-RAMs)
Jousseaume, V, Fantini, A, Nodin, J F, Guedj, C, Persico, A, Buckley, J, Tirano, S, Lorenzi, P, Vignon, R, Feldis, H, Minoret, S, Grampeix, H, Roule, A, Favier, S, Martinez, E, Calka, P, Rochat, N, Auvert, G, Barnes, J P, Gonon, P, Vallee, C, Perniola, L, De Salvo, B
Published in Solid-state electronics (01.04.2011)
Published in Solid-state electronics (01.04.2011)
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Journal Article
Comparative study of non-polar switching behaviors of NiO- and HfO2-based oxide resistive-RAMs: Special Issue Devoted to the 2nd International Memory Workshop (IMW 2010)
JOUSSEAUME, V, FANTINI, A, MINORET, S, GRAMPEIX, H, ROULE, A, FAVIER, S, MARTINEZ, E, CALKA, P, ROCHAT, N, AUVERT, G, BARNES, J. P, GONON, P, NODIN, J. F, VALLEE, C, PERNIOLA, L, DE SALVO, B, GUEDJ, C, PERSICO, A, BUCKLEY, J, TIRANO, S, LORENZI, P, VIGNON, R, FELDIS, H
Published in Solid-state electronics (2011)
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Published in Solid-state electronics (2011)
Journal Article
Ni2P Contact Technology for 300 mm Si Photonics Platform
Boyer, F., Famulok, R., Minoret, S., Coudurier, N., Jany, C., Gergaud, P., Rodriguez, Ph
Published in 2021 20th International Workshop on Junction Technology (IWJT) (10.06.2021)
Published in 2021 20th International Workshop on Junction Technology (IWJT) (10.06.2021)
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Conference Proceeding
Active Interposer Technology for Chiplet-Based Advanced 3D System Architectures
Coudrain, Perceval, Chausse, P., Arnaud, L., Lattard, D., Guthmuller, E., Romano, G., Gueugnot, A., Berger, F., Beltritti, J., Mourier, T., Gottardi, M., Charbonnier, J., Minoret, S., Ribiere, C., Romero, G., Philip, P.-E., Exbrayat, Y., Scevola, D., Campos, D., Argoud, M., Allouti, N., Eleouet, R., Garnier, A., Fuguet Tortolero, C., Aumont, C., Dutoit, D., Legalland, C., Michailos, J., Cheramy, S., Simon, G., Vivet, P., Velard, R., Vinci, A., Ponthenier, F., Farcy, A., Segaud, R.
Published in 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) (01.05.2019)
Published in 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) (01.05.2019)
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Conference Proceeding
Understanding of the thermal stability of the hafnium oxide/TiN stack via 2 "high k" and 2 metal deposition techniques
Cosnier, V., Besson, P., Loup, V., Vandroux, L., Minoret, S., Casse, M., Garros, X., Pedini, Jm, Lhostis, S., Dabertrand, K., Morin, Céline, Wiemer, C., Perego, M., Fanciulli, M.
Published in Microelectronic engineering (2007)
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Published in Microelectronic engineering (2007)
Journal Article
Investigations of titanium nitride as metal gate material, elaborated by metal organic atomic layer deposition using TDMAT and NH 3
Fillot, F., Morel, T., Minoret, S., Matko, I., Maîtrejean, S., Guillaumot, B., Chenevier, B., Billon, T.
Published in Microelectronic engineering (2005)
Published in Microelectronic engineering (2005)
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Journal Article