Chip-level Thermal Simulation for a Multicore Processor Using a Multi-Block Model Enabled by Proper Orthogonal Decomposition
Jiang, Lin, Dowling, Anthony, Liu, Yu, Cheng, Ming-C.
Published in 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) (31.05.2022)
Published in 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) (31.05.2022)
Get full text
Conference Proceeding
Exploring an Efficient Approach for Architecture-Level Thermal Simulation of Multi-core CPUs
Jiang, Lin, Dowling, Anthony, Liu, Yu, Cheng, Ming-C.
Published in 2022 IEEE International Symposium on Circuits and Systems (ISCAS) (28.05.2022)
Published in 2022 IEEE International Symposium on Circuits and Systems (ISCAS) (28.05.2022)
Get full text
Conference Proceeding
A Quantum Element Reduced Order Model
Cheng, Ming-C.
Published in 2019 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) (01.09.2019)
Published in 2019 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) (01.09.2019)
Get full text
Conference Proceeding
Ensemble learning model for effective thermal simulation of multi-core CPUs
Jiang, Lin, Dowling, Anthony, Liu, Yu, Cheng, Ming-C.
Published in Integration (Amsterdam) (01.07.2024)
Published in Integration (Amsterdam) (01.07.2024)
Get full text
Journal Article
Thermal Simulation of a CPU Based on Model Order Reduction
Ruttan, Kayla, Jiang, Lin, Dowling, Anthony, Liu, Yu, Cheng, Ming-C.
Published in 2020 IEEE MIT Undergraduate Research Technology Conference (URTC) (09.10.2020)
Published in 2020 IEEE MIT Undergraduate Research Technology Conference (URTC) (09.10.2020)
Get full text
Conference Proceeding