by Aibin Yu, Lau, J. H., Soon Wee Ho, Kumar, A., Wai Yin Hnin, Wen Sheng Lee, Ming Ching Jong, Sekhar, V. N., Kripesh, V., Pinjala, D., Chen, S., Chien-Feng Chan, Chun-Chieh Chao, Chi-Hsin Chiu, Chih-Ming Huang, Chen, C.
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.09.2011)

by AIBIN YU, KUMAR, Aditya, CHAN, Chien-Feng, CHAO, Chun-Chieh, CHIU, Chi-Hsin, CHAN, Chang-Yueh, CHANG, Chin-Huang, HUANG, Chih-Ming, CARL CHEN, SOON WEE HO, HNIN WAI YIN, LAU, John H, SU, Nandar, KHONG CHEE HOUE, JONG MING CHING, KRIPESH, Vaidyanathan, CHEN, Scott
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.11.2012)

by Guan, Lim Teck, Ching, Eva Wai Leong, Ching, Jong Ming, Leng, Loh Woon, Wee, David Ho Soon, Bhattacharya, Surya
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.01.2021)

by Yu, A., Lau, J.H., Soon Wee Ho, Kumar, A., Hnin Wai Yin, Jong Ming Ching, Kripesh, V., Pinjala, D., Chen, S., Chien-Feng Chan, Chun-Chieh Chao, Chi-Hsin Chiu, Chih-Ming Huang, Chen, C.
Published in 2009 59th Electronic Components and Technology Conference (01.05.2009)

by Aibin Yu, Kumar, A., Soon Wee Ho, Hnin Wai Yin, Lau, J.H., Khong Chee Houe, Lim Pei Siang, S., Xiaowu Zhang, Da-Quan Yu, Nandar Su, Chew Bi-Rong, M., Jong Ming Ching, Tan Teck Chun, Kripesh, V., Lee, C., Jun Pin Huang, Chiang, J., Chen, S., Chi-Hsin Chiu, Chang-Yueh Chan, Chin-Huang Chang, Chih-Ming Huang, Cheng-Hsu Hsiao
Published in 2008 10th Electronics Packaging Technology Conference (01.12.2008)

by Yu, Aibin, Kumar, Aditya, Ho, Soon Wee, Yin, Hnin Wai, Lau, John H, Su, Nandar, Houe, Khong Chee, Ching, Jong Ming, Kripesh, Vaidyanathan, Chen, Scott, Chan, Chien-Feng, Chao, Chun-Chieh, Chiu, Chi-Hsin, Chan, Chang-Yueh, Chang, Chin-Huang, Huang, Chih-Ming, Chen, Carl
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.11.2012)

by Aibin Yu, Kumar, A., Soon Wee Ho, Hnin Wai Yin, Lau, J. H., Su, Nandar, Khong Chee Houe, Jong Ming Ching, Kripesh, V., Chen, S., Chien-Feng Chan, Chun-Chieh Chao, Chi-Hsin Chiu, Chang-Yueh Chan, Chin-Huang Chang, Chih-Ming Huang, Chen, C.
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.11.2012)

by Yu, Aibin, Kumar, Aditya, Ho, Soon Wee, Yin, Hnin Wai, Lau, John H, Su, Nandar, Houe, Khong Chee, Ching, Jong Ming, Kripesh, Vaidyanathan, Chen, Scott, Chan, Chien-Feng, Chao, Chun-Chieh, Chiu, Chi-Hsin, Chan, Chang-Yueh, Chang, Chin-Huang, Huang, Chih-Ming, Chen, Carl
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.11.2012)

by Ong, Yue Ying, Chai, Tai Chong, Yu, Daquan, Thew, Meei Leng, Myo, Eipa, Wai, Leong Ching, Jong, Ming Chinq, Rao, Vempati Srinivasa, Su, Nandar, Zhang, Xiaowu, Damaruganath, Pinjala
Published in 2009 11th Electronics Packaging Technology Conference (01.12.2009)

by Aibin Yu, Lau, J.H., Soon Wee Ho, Kumar, A., Wai Yin Hnin, Da-Quan Yu, Ming Ching Jong, Kripesh, V., Pinjala, D., Dim-Lee Kwong
Published in 2009 59th Electronic Components and Technology Conference (01.05.2009)

by Seung Wook Yoon, Wirtasa, D., Lim, S., Jong Ming Ching, Kripesh, V.
Published in 2005 7th Electronic Packaging Technology Conference (2005)

by Ong, Y.Y., Vaidyanathan, K., Ho, S.W., Sekhar, V.N., Jong, M.C., Wai, L.C., Rao, V.S., Sheng, V., Ong, J., Ong, X., Zhang, X., Seung, Y.U., Lau, J., Lim, Y.K., Yeo, D., Chan, K.C., Yanfeng, Z., Tan, J.B., Sohn, D.K.
Published in 2008 10th Electronics Packaging Technology Conference (01.12.2008)