High Reliability Challenges with Cu Wire Bonding for Automotive Devices in the AEC-Q006
JunHo Jeon, SeokHo Na, SungHo Jeon, Mina Mo, DaeByoung Kang, Kwangmo Lim, JinYoung Kim
Published in 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) (01.05.2017)
Published in 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) (01.05.2017)
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Conference Proceeding
On the Process/History Dependence of Package Mechanical Performance
Mingji Wang, Nicholls, Lou, Mina Mo, Minjae Lee, Quan Pham, Yong Song
Published in 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) (01.05.2017)
Published in 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) (01.05.2017)
Get full text
Conference Proceeding