Flat lead package formation method
Miethaner, Stefan, Scherl, Peter, Heinrich, Alexander, Theuss, Horst, Bradl, Stephan, Meyer, Thorsten, Ofner, Gerald
Year of Publication 16.05.2023
Get full text
Year of Publication 16.05.2023
Patent
Multi-purpose non-linear semiconductor package assembly line
Miethaner, Stefan, Scherl, Peter, Heinrich, Alexander, Theuss, Horst, Bradl, Stephan, Meyer, Thorsten, Ofner, Gerald
Year of Publication 12.04.2022
Get full text
Year of Publication 12.04.2022
Patent
Molding compound and semiconductor package with a molding compound
Melzner, Hanno, Hellmund, Oliver, Mauder, Anton, Miethaner, Stefan, Irsigler, Peter, Schulze, Hans-Joachim, Schmidt, Sebastian
Year of Publication 20.07.2021
Get full text
Year of Publication 20.07.2021
Patent
Flat Lead Package Formation Method
Miethaner, Stefan, Scherl, Peter, Heinrich, Alexander, Theuss, Horst, Bradl, Stephan, Meyer, Thorsten, Ofner, Gerald
Year of Publication 11.02.2021
Get full text
Year of Publication 11.02.2021
Patent
Measuring Sodium Migration in Mold Compounds Using a Sodium Amalgam Electrode as an Infinite Source
Schwab, Stefan, Appenroth, Julia, Bonta, Maximilian, Holzer, Sabine, Bauer, Michael, Miethaner, Stefan, Limbeck, Andreas, Nelhiebel, Michael, Weinberger, Peter, Hutter, Herbert
Published in 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) (01.05.2017)
Published in 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) (01.05.2017)
Get full text
Conference Proceeding
Multi-Purpose Non-Linear Semiconductor Package Assembly Line
Miethaner, Stefan, Scherl, Peter, Heinrich, Alexander, Theuss, Horst, Bradl, Stephan, Meyer, Thorsten, Ofner, Gerald
Year of Publication 25.06.2020
Get full text
Year of Publication 25.06.2020
Patent
Multi-purpose non-linear semiconductor package assembly line
Scherl, Peter, Miethaner, Stefan, Heinrich, Alexander, Theuss, Horst, Bradl, Stephan, Meyer, Thorsten, Ofner, Gerald
Year of Publication 18.02.2020
Get full text
Year of Publication 18.02.2020
Patent
FORMMASSE UND HALBLEITER-PACKAGE MIT FORMMASSE
Melzner, Hanno, Hellmund, Oliver, Mauder, Anton, Miethaner, Stefan, Irsigler, Peter, Schulze, Hans-Joachim, Schmidt, Sebastian
Year of Publication 12.09.2024
Get full text
Year of Publication 12.09.2024
Patent
Molding Compound and Semiconductor Package with a Molding Compound
Melzner, Hanno, Hellmund, Oliver, Mauder, Anton, Miethaner, Stefan, Irsigler, Peter, Schulze, Hans-Joachim, Schmidt, Sebastian
Year of Publication 17.10.2019
Get full text
Year of Publication 17.10.2019
Patent
Multi-Purpose Non-Linear Semiconductor Package Assembly Line
Scherl Peter, Miethaner Stefan, Heinrich Alexander, Bradl Stephan, Meyer Thorsten, Ofner Gerald, Theuss Horst
Year of Publication 05.04.2018
Get full text
Year of Publication 05.04.2018
Patent