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Lock-V: A heterogeneous fault tolerance architecture based on Arm and RISC-V
Marques, Ivo, Rodrigues, Cristiano, Tavares, Adriano, Pinto, Sandro, Gomes, Tiago
Published in Microelectronics and reliability (01.05.2021)
Published in Microelectronics and reliability (01.05.2021)
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Experimental investigation of PCB embedded 1200 V IGBT/diode power pre-package under high-humidity high-temperature reverse voltage bias
Huesgen, T., Sharma, A.B., Rawal, K.B., Polezhaev, V., Stohrer, G., Koch, F., Vaas, M.
Published in Microelectronics and reliability (01.11.2022)
Published in Microelectronics and reliability (01.11.2022)
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Deep neural networks-based rolling bearing fault diagnosis
Chen, Zhiqiang, Deng, Shengcai, Chen, Xudong, Li, Chuan, Sanchez, René-Vinicio, Qin, Huafeng
Published in Microelectronics and reliability (01.08.2017)
Published in Microelectronics and reliability (01.08.2017)
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A lifetime assessment and prediction method for large area solder joints
Lederer, M., Kotas, A. Betzwar, Khatibi, G.
Published in Microelectronics and reliability (01.11.2020)
Published in Microelectronics and reliability (01.11.2020)
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An improved unscented particle filter approach for lithium-ion battery remaining useful life prediction
Zhang, Heng, Miao, Qiang, Zhang, Xin, Liu, Zhiwen
Published in Microelectronics and reliability (01.02.2018)
Published in Microelectronics and reliability (01.02.2018)
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Threshold voltage peculiarities and bias temperature instabilities of SiC MOSFETs
Aichinger, Thomas, Rescher, Gerald, Pobegen, Gregor
Published in Microelectronics and reliability (01.01.2018)
Published in Microelectronics and reliability (01.01.2018)
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Comphy — A compact-physics framework for unified modeling of BTI
Rzepa, G., Franco, J., O’Sullivan, B., Subirats, A., Simicic, M., Hellings, G., Weckx, P., Jech, M., Knobloch, T., Waltl, M., Roussel, P.J., Linten, D., Kaczer, B., Grasser, T.
Published in Microelectronics and reliability (01.06.2018)
Published in Microelectronics and reliability (01.06.2018)
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Large area bare Cu-Cu interconnection using micro-Cu paste at different sintering temperatures and pressures
Li, W.Y., Chen, C.T., Ueshima, M., Kobatake, T., Suganuma, K.
Published in Microelectronics and reliability (01.11.2023)
Published in Microelectronics and reliability (01.11.2023)
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Lithium-ion battery performance degradation evaluation in dynamic operating conditions based on a digital twin model
Qu, X., Song, Y., Liu, D., Cui, X., Peng, Y.
Published in Microelectronics and reliability (01.11.2020)
Published in Microelectronics and reliability (01.11.2020)
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A lithium-ion battery remaining useful life prediction method based on the incremental capacity analysis and Gaussian process regression
Pang, Xiaoqiong, Liu, Xiaoyan, Jia, Jianfang, Wen, Jie, Shi, Yuanhao, Zeng, Jianchao, Zhao, Zhen
Published in Microelectronics and reliability (01.12.2021)
Published in Microelectronics and reliability (01.12.2021)
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A review: On the development of low melting temperature Pb-free solders
Kotadia, Hiren R., Howes, Philip D., Mannan, Samjid H.
Published in Microelectronics and reliability (01.06.2014)
Published in Microelectronics and reliability (01.06.2014)
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An ensemble model for predicting the remaining useful performance of lithium-ion batteries
Xing, Yinjiao, Ma, Eden W.M., Tsui, Kwok-Leung, Pecht, Michael
Published in Microelectronics and reliability (01.06.2013)
Published in Microelectronics and reliability (01.06.2013)
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Data-driven hybrid remaining useful life estimation approach for spacecraft lithium-ion battery
Song, Yuchen, Liu, Datong, Yang, Chen, Peng, Yu
Published in Microelectronics and reliability (01.08.2017)
Published in Microelectronics and reliability (01.08.2017)
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A comparative study of thermal fatigue life of Eutectic Sn-Bi, Hybrid Sn-Bi/SAC and SAC solder alloy BGAs
Cai, Chongyang, Xu, Jiefeng, Wang, Huayan, Park, S.B.
Published in Microelectronics and reliability (01.04.2021)
Published in Microelectronics and reliability (01.04.2021)
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