Search Results - "Microelectronics and reliability" :: K.UTB vyhledávací portál

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Geometry-driven physics-of-failure lifetime analysis of aluminum bonding wires in discrete SiC power electronics

by Kilian, Borja, Maniar, Youssef, Gleichauf, Jonas, Wittler, Olaf, Schneider-Ramelow, Martin
Published in Microelectronics and reliability (01.09.2025)

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Microstructure and properties of Cu/In-Sn-xZn-yAg/Cu solder joints after thermal aging

by He, Yucong, Zheng, Yang, Liu, Zheng, Jiao, Xixuan, Zhang, Yaocheng, Yang, Li, Zhao, Xiuting
Published in Microelectronics and reliability (01.09.2025)

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High-performance, low-area-overhead, and low-delay triple-node-upset self-recoverable latch design based on stacked transistors

by Xu, Hui, Dai, Yue, Ma, Ruijun, Liang, Huaguo, Huang, Zhengfeng, Ni, Tianming, Zhang, Chuanjian, Chen, Xin, Tang, Ye
Published in Microelectronics and reliability (01.09.2025)

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Local thermal runaway during surge events in power rectifiers

by Bergmann, Ole Jonathan, Boettcher, Tim, Vu, Hoan, Trieu, Hoc Khiem
Published in Microelectronics and reliability (01.09.2025)

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Thermal stress reduction strategy for high-temperature power electronics with Ag sintering

by Ren, Hui, Zou, Guisheng, Jia, Qiang, Deng, Zhongyang, Du, Chengjie, Wang, Wengan, Liu, Lei
Published in Microelectronics and reliability (01.12.2021)

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Threshold voltage instability in SiO2-gate semi-vertical GaN trench MOSFETs grown on silicon substrate

by Fregolent, M., Del Fiol, A., De Santi, C., Huber, C., Meneghesso, G., Zanoni, E., Meneghini, M.
Published in Microelectronics and reliability (01.11.2023)

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Battery remaining useful life prediction at different discharge rates

by Wang, Dong, Yang, Fangfang, Zhao, Yang, Tsui, Kwok-Leung
Published in Microelectronics and reliability (01.11.2017)

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Effect of Bi content and aging on solder joint shear properties considering strain rate

by Belhadi, Mohamed El Amine, Hamasha, Sa'd, Alahmer, Ali
Published in Microelectronics and reliability (01.07.2023)

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Fault and self-repair for high reliability in die-to-die interconnection of 2.5D/3D IC

by Song, Renhao, Zhang, Junqin, Zhu, Zhanqi, Shan, Guangbao, Yang, Yintang
Published in Microelectronics and reliability (01.07.2024)

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Cross-scale finite element analysis of PCBA thermal cycling based on manufacturing history for more accurate fatigue life prediction of solder joints

by Zheng, Ruiqian, Li, Wenqian, Cheng, Mengxuan, Zheng, Hao, Zhao, Zhiyan, Wan, Guoshun, Jia, Yuxi
Published in Microelectronics and reliability (01.09.2024)

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Impact of aging on temperature measurements performed using a resistive temperature sensor with sensor-to-microcontroller direct interface

by Grossi, Marco, Omaña, Martin, Metra, Cecilia
Published in Microelectronics and reliability (01.06.2025)

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Ultimate thermal stress reliability evaluation of 3D packaged memory

by Zhou, Shuai, Ma, Kaixue, Wu, Yugong, Liu, Shoufu, Ma, Chi
Published in Microelectronics and reliability (01.06.2025)

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Aging investigation of the latest standard dual power modules using improved interconnect technologies by power cycling test

by Zhang, Yi, Wu, Rui, Iannuzzo, Francesco, Wang, Huai
Published in Microelectronics and reliability (01.11.2022)

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Multi-objective optimal design of thermal-vibration stress and return loss of TSV interconnect structures based on response surface-NSWOA optimization algorithm

by Wang, Lilin, Huang, Chunyue, Huang, Lixiang, Liang, Ying, Gao, Chao, Liu, Xianjia, Cao, Zhiqin
Published in Microelectronics and reliability (01.01.2025)

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Reduced-order model for solder balls – Potential of projection-based approaches for representing viscoplastic behavior

by Feuchter, Mike, Baumgartl, Hanna, Hanke, Martin, Wunderle, Bernhard, Rzepka, Sven
Published in Microelectronics and reliability (01.08.2025)

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Dependence between drain current saturation level and short-circuit robustness of p-GaN HEMTs

by Dedew, M.L., Lefebvre, S., Nguyen, T.A., Le, T.L., Rustichelli, V., Oliveira, J., Alam, M., Coccetti, F.
Published in Microelectronics and reliability (01.08.2025)

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Optimized semi-physical EKV model for simulation of SiC MOSFETs

by Bonkoungou, B.D.R., Gwoziecki, R., Perez, G., Sterna, L., Khatir, Z.
Published in Microelectronics and reliability (01.08.2025)

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Single-particle irradiation effect and anti-irradiation optimization of a heterogeneous dielectric vertical TFET with dual material gate

by Xie, Haiwu, Yu, Fujin
Published in Microelectronics and reliability (01.08.2025)

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Reliability assessment of SiC power MOSFETs in dynamic reverse bias test

by Sitta, Alessandro, Mauromicale, Giuseppe, Fiore, Michele, Calabretta, Michele
Published in Microelectronics and reliability (01.08.2025)

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Exploring the fracture mechanism of multilayer ceramic capacitors via combined simulation and experiment

by Yang, Sen, Xu, Qin, Shen, Fei, Ke, Liao-Liang
Published in Microelectronics and reliability (01.08.2025)

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