Search Results - "Microelectronics and reliability" :: K.UTB vyhledávací portál

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Effect of PCB fastening method and thickness on PCB assembly vibration reliability in thermal environments

by Liu, Fang, Gong, Runze, Duan, Zhongwei, Wang, Zhen, Zhou, Jiacheng
Published in Microelectronics and reliability (01.02.2025)

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Systematic performance benchmarking of nanosheet and FinFET: An intrinsic self-heating perspective

by Rathore, Sunil, Jaisawal, Rajeewa Kumar, Agnihotri, Suneet Kumar, Gandhi, Navneet, Kondekar, P.N., Bagga, Navjeet
Published in Microelectronics and reliability (01.02.2025)

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Design of an energy-efficient soft error resilient RHBD SRAM cell with high read stability and minimum write errors

by Joseph, Biby, Kavitha, R.K.
Published in Microelectronics and reliability (01.09.2025)

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Thermo-electrical reliability of power MOSFETs influenced by packaging architecture in stack-die and single-die configurations

by Jang, You-Cheol
Published in Microelectronics and reliability (01.09.2025)

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Machine learning-based surrogate models for finned heatsink thermal modeling

by Wang, Z., Zhang, Y., Wang, H.
Published in Microelectronics and reliability (01.09.2025)

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Separate investigation of performance degradation for the Si and GaN parts in cascode GaN devices under repetitive short circuits

by Lu, Zhebie, Iannuzzo, Francesco
Published in Microelectronics and reliability (01.09.2025)

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Reliability analysis of dopingless vertical nanowire TFET with interface trap charges for ring-oscillator circuit implementation

by Bhardwaj, Anjana, Das, Amit, Yadav, Ranjeeta, Kumar, Pradeep
Published in Microelectronics and reliability (01.09.2025)

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Research on high-power high-frequency electrical transmission characteristics of through glass via interconnections

by Chen, Luming, Wang, Shitao, Wei, Zhilin, Wang, Zhizhen, Xie, Yihan, Li, Chunlei, Ma, Shenglin, He, Shuwei, Yuan, Hai
Published in Microelectronics and reliability (01.09.2025)

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Reading reliability analysis and modeling in 1S1R devices based on Phase-Change Memory and Ovonic Threshold Switching selector integrated in a double-patterned self-aligned structure

by Antonelli, Renzo, De Camaret, C., Bourgeois, G., Saghi, Z., Monniez, T., Martin, S., Castellani, N., Bernard, M., Fellouh, L., Salvi, A., Gout, S., Andrieu, F., Souifi, A., Navarro, G.
Published in Microelectronics and reliability (01.09.2025)

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Crack propagation in ultrasonic-bonded copper wires investigated by power cycling and accelerated mechanical fatigue interconnection test methods

by Karanja, L., Pichon, P., Legros, M.
Published in Microelectronics and reliability (01.09.2025)

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Thermal-mechanical analysis of copper pillar pitch size during reflow soldering assembly process

by Lee, Jing Rou, Aziz, Mohd Sharizal Abdul, Khor, Chu Yee, Ishaik, Mohammad Hafifi Hafiz, Simanjuntak, Janter Pangaduan, Wong, Yong Jie
Published in Microelectronics and reliability (01.09.2025)

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Thermo-mechanical analysis on 10 kV SiC-MOSFETs to improve the reliability of solder layers

by Takahashi, Masaki, Sun, Zhongchao, Watanabe, Akihiko, Omura, Ichiro, Munk-Nielsen, Stig, Jørgensen, Asger Bjørn
Published in Microelectronics and reliability (01.09.2025)

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A comparative study between the improved unified creep-plasticity model and Anand model: Experimental investigations at the material-scale and packaging structure-scale

by Yang, Fan, Wang, Yuexing, Cao, Linwei, Sun, Xiangyu, Yao, Yao
Published in Microelectronics and reliability (01.09.2025)

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Interfacial fracture behavior of polyimide/copper in RDL structures for advanced electronic packaging

by Chen, Wenqing, Wang, Yuexing, Li, Bofeng, Yao, Shuai, Qiao, Jichao, Sun, Xiangyu
Published in Microelectronics and reliability (01.09.2025)

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Mechanical and electrical testing of encapsulated stretchable substrate interconnect models for emerging flexible electronic systems

by Bhatti, Gulafsha, Agrawal, Yash, Palaparthy, Vinay, Sharma, Rohit, Kumar, Mekala Girish
Published in Microelectronics and reliability (01.09.2025)

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Condition monitoring for detection of humidity-induced failures in control electronics of power converters

by Sehr, F., Wagner, S., Schulz, A., Vorwerk, A.
Published in Microelectronics and reliability (01.09.2025)

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Long-term positive and negative gate bias stress tests on parallel connected SiC MOSFETs at −40 °C and 175 °C

by Deb, A., Taha, M., Gonzalez, J. Ortiz, Mawby, P., Jahdi, S., Etoz, B., Alatise, O.
Published in Microelectronics and reliability (01.09.2025)

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Gate oxide lifetime modeling of vertical SiC-MOS under accelerated reverse bias (ARB)

by Biswas, Ayan K., Lichtenwalner, Daniel J., Hull, Brett, Gajewski, Donald A.
Published in Microelectronics and reliability (01.09.2025)

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Remaining useful life prediction of DC contactor based on LSTM

by Wang, Yu, Xie, Yong, Liang, Huimin, Ma, Hangyu
Published in Microelectronics and reliability (01.09.2025)

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Solder joint reliability predictions using physics-informed machine learning

by de Jong, S.D.M., Ghezeljehmeidan, A.G., van Driel, W.D.
Published in Microelectronics and reliability (01.09.2025)

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