Search Results - "Microelectronics and reliability" :: K.UTB vyhledávací portál

Loading…

Grain morphology effect on interfacial void closure in Cu–Cu bonding for advanced semiconductor packaging

by Jiang, Han, Xu, Yaohua, Ramachandran, Saranarayanan, Liang, Shuibao
Published in Microelectronics and reliability (01.10.2025)

Get full text

Journal Article

Loading…

Investigation of DFF cells SEU effect for 14 nm bulk silicon FinFET technology irradiated by heavy ions

by Li, Hai-song, Wang, Bin, Jiang, Yi-hu, Yang, Bo, Gao, Li-jun, Yue, Hong-ju
Published in Microelectronics and reliability (01.10.2025)

Get full text

Journal Article

Loading…

Accelerated flowers of sulfur test method for power semiconductor modules

by Kaminski, Daniel T., Genthe, Christopher, Church, Benjamin C.
Published in Microelectronics and reliability (01.10.2025)

Get full text

Journal Article

Loading…

Stress–strain analysis and optimization of BGA stacked solder joints under extreme temperatures based on orthogonal design and grey relational analysis

by Chen, Yonglin, Huang, Chunyue, Gao, Chao, Wang, Gui
Published in Microelectronics and reliability (01.10.2025)

Get full text

Journal Article

Loading…

Physics-informed deep learning approach for nanoindentation-based thin film analysis

by Ozdemir, Yusuf Burak, Okudur, Oguzhan Orkut, Gonzalez, Mario, Merckling, Clement
Published in Microelectronics and reliability (01.10.2025)

Get full text

Journal Article

Loading…

Significance of phase formation in multicomponent lead-free solder alloys

by Zareipour, Farzaneh, Shahmir, Hamed, Mirzavand-Borujeni, Ali, Derakhshandeh, Alireza, Forghani, Farsad
Published in Microelectronics and reliability (01.10.2025)

Get full text

Journal Article

Loading…

Thermal-mechanical coupling analysis of Micro-LED bonding based on copper pillar bump

by Fu, Hao, Yang, Zhu, Meng, Xinhui, Fan, Hong, Lu, Xiuzhen, Yin, Luqiao, Zhang, Jianhua
Published in Microelectronics and reliability (01.10.2025)

Get full text

Journal Article

Loading…

Free-standing silver nanobelt foils for sintering die bonding of power electronics and its power cycle reliability

by Wang, Xinda, Xu, Yanli, Guo, Wei, Peng, Zilong, Zhang, Hongqiang, Zhou, Xingwen
Published in Microelectronics and reliability (01.10.2025)

Get full text

Journal Article

Loading…

Modified TCAD simulation approach for 4H-SiC JBS diode to investigate electron trapping effects

by Kumari, Shikha, Brosselard, Pierre, Planson, Dominique, Raja, P. Vigneshwara
Published in Microelectronics and reliability (01.10.2025)

Get full text

Journal Article

Loading…

Monitoring method for bond wire aging in IGBT modules based on gate voltage ringing frequency

by Du, Mingxing, Zhou, Jinlin, Yang, Jianxiong, Gu, Haiqing
Published in Microelectronics and reliability (01.10.2025)

Get full text

Journal Article

Loading…

Low-voltage Schottky p-GaN HEMT properties under extreme repetitive short-circuit operation conditions: 2DEG pinch-off, stability, aging, robustness and failure-modes analysis - Selected and Extended Full Paper from ESREF'24

by Richardeau, Frédéric, Ghizzo, L., Trémouilles, D., Vinnac, S.
Published in Microelectronics and reliability (01.10.2025)

Get full text

Journal Article

Loading…

Lifetime estimation of IGBT modules for MMC-HVDC application

by Wang, Longjun, Xu, Jiayou, Wang, Gang, Zhang, Zheng
Published in Microelectronics and reliability (01.03.2018)

Get full text

Journal Article

Loading…

A simulation-based analysis of effect of interface trap charges on dc and analog/HF performances of dielectric pocket SOI-Tunnel FET

by Pandey, Chandan K., Singh, A., Chaudhury, S.
Published in Microelectronics and reliability (01.07.2021)

Get full text

Journal Article

Loading…

Effects of solder solidification temperature on residual stress distribution and failure location in BGA solder joints

by Razzaq, Mohammed Abdel, Meilunas, Michael, Cao, Xian A., Wilcox, Jim, Ramini, Abdallah
Published in Microelectronics and reliability (01.03.2025)

Get full text

Journal Article

Loading…

Reliability estimation of thin film platinum resistance MEMS thermal mass flowmeter by step-stress accelerated life testing

by Kang, Qiaoqiao, Li, Yan, Zhao, Jia, Tao, Jifang
Published in Microelectronics and reliability (01.08.2023)

Get full text

Journal Article

Loading…

Degradation prediction of IGBT module based on CNN-LSTM network

by Bai, Liangjun, Huang, Meng, Pan, Shangzhi, Li, Kang, Zha, Xiaoming
Published in Microelectronics and reliability (01.05.2025)

Get full text

Journal Article

Loading…

Reliability of automotive and consumer MEMS sensors - An overview

by Hommel, M., Knab, H., Yousef, S. Galal
Published in Microelectronics and reliability (01.11.2021)

Get full text

Journal Article

Loading…

Enhancing flexible electronics: Unveiling the role of strain rate in the performance of molybdenum-coated PET films

by Alkhazali, Atif, Hamasha, Mohammad M., Khaled, Haitham, Shbool, Mohammad, Obaidat, Mazin
Published in Microelectronics and reliability (01.10.2024)

Get full text

Journal Article

Loading…

Study of trapping mechanisms affecting AlGaN/GaN HEMTs adopting AlGaN back-barriers with different aluminum concentrations

by Carlotto, Andrea, Rampazzo, Fabiana, Saro, Marco, De Pieri, Francesco, Fregolent, Manuel, De Santi, Carlo, Meneghesso, Gaudenzio, Meneghini, Matteo, Zanoni, Enrico
Published in Microelectronics and reliability (01.07.2025)

Get full text

Journal Article

Loading…

Machine learning for board-level drop response of BGA packaging structure

by Mao, Minghui, Wang, Wenwu, Lu, Changheng, Jia, Fengrui, Long, Xu
Published in Microelectronics and reliability (01.07.2022)

Get full text

Journal Article

Refine Results

Format

Subject Area

Topic

Language

Year of Publication

Database