Search Results - "Microelectronics and reliability" :: K.UTB vyhledávací portál

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Investigation of hygrothermally induced failures in multilayer ceramic capacitors during thermal reflow process

by Apalowo, Rilwan Kayode, Abas, Aizat, Bachok, Zuraihana, Sharif, Mohamad Fikri Mohd, Ani, Fakhrozi Che, Ramli, Mohamad Riduwan, Mukhtar, Muhamed Abdul Fatah bin Muhamed
Published in Microelectronics and reliability (01.07.2023)

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Microstructure evolution and hardness of MWCNT-reinforced Sn-5Sb/Cu composite solder joints under different thermal aging conditions

by Dele-Afolabi, T.T., Hanim, M.A. Azmah, Calin, R., Ilyas, R.A.
Published in Microelectronics and reliability (01.07.2020)

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Failure modes and mechanism analysis of SiC MOSFET under short-circuit conditions

by Jiang, Xi, Wang, Jun, Lu, Jiwu, Chen, Jianjun, Yang, Xin, Li, Zongjian, Tu, Chunming, Shen, Z. John
Published in Microelectronics and reliability (01.09.2018)

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Impact of near interface defects on NO annealed SiC MOSFET mobility

by Wen, Yu-Xin, Tsui, Bing-Yue, Cheung, Kin P.
Published in Microelectronics and reliability (01.10.2025)

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Microstructure and diffusion mechanisms in nano-Cu sintered joints during aging: Effects of joint size, porosity, and aging atmosphere

by Wang, Shuaiqi, Zou, Guisheng, Huo, Jinpeng, Du, Rongbao, Liu, Lei
Published in Microelectronics and reliability (01.10.2025)

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C-SMART: A preprocessor for neural network performance and reliability under radiation

by Justus Rajappa, Anuj, Reiter, Philippe, Rech, Paolo, Mercelis, Siegfried, Famaey, Jeroen
Published in Microelectronics and reliability (01.10.2025)

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RHBD current-mode bandgap with SET isolation using PVT-independent sensors

by Cardenas Chavez, Jaime, Yan, Ming, Sandhu, Tejinder, Cundar, Adriana Noguera, El-Sankary, Kamal, Chen, Li
Published in Microelectronics and reliability (01.10.2025)

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Electrical and reliability characterization with an optimized extrapolation model of two- and three-dimensional metal-insulator-metal decoupling capacitors with ZrAlxOy high-κ dielectric under BEoL-friendly conditions

by Falidas, Konstantinos Efstathios, Kühnel, Kati, Rudolph, Matthias, Everding, Maximilian, Reck, André, Czernohorsky, Malte, Heitmann, Johannes
Published in Microelectronics and reliability (01.10.2025)

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Condition monitoring of a DC-link capacitor in an inverter with a front-end diode rectifier under imbalanced three-phase supply voltage

by Yamasoto, Takuma, Hasegawa, Kazunori
Published in Microelectronics and reliability (01.10.2025)

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A physics-based electromigration model for advanced interconnects

by Chen, Wangyong, Yin, Binyu, Cai, Linlin, Wan, Yi
Published in Microelectronics and reliability (01.10.2025)

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Low-voltage Schottky p-GaN HEMT properties under extreme repetitive short-circuit operation conditions: 2DEG pinch-off, stability, aging, robustness and failure-modes analysis

by Richardeau, F., Ghizzo, L., Trémouilles, D., Vinnac, S.
Published in Microelectronics and reliability (01.10.2025)

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Effect of Al content on microstructure and solder joint reliability of SAC305-2.0Sb-3.0Bi-0.1Ni solder alloys

by Xiang, Yipeng, Xu, Jiayi, Wang, Biao, Zhao, Jianhua, Yan, Jikang
Published in Microelectronics and reliability (01.10.2025)

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Conducted EMI assessment of aging power Si-MOSFET in 3 phase inverter

by TLIG, Mohamed, ZITOUNA, Bassem, KADI, Moncef, HAMMOUDA, Mahmoud, BEN HADJ SLAMA, Jaleleddine
Published in Microelectronics and reliability (01.10.2025)

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Effect of electro-mechanical coupling on the electrical performance and microvoid evolution of Sn3.0Ag0.5Cu solder joint

by Guo, Weiqi, Liu, Peng, Bi, Yinghao, Zhao, Shuaifeng, Wu, Ping
Published in Microelectronics and reliability (01.10.2025)

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Study on the optimization of bending-vibration coupling stress of QFN solder joints based on Taguchi orthogonal experimental design and Harris Hawks Optimization algorithm

by Wei, Jisheng, Huang, Chunyue, Gao, Chao, Wang, Gui
Published in Microelectronics and reliability (01.10.2025)

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Towards Extended Hückel model-based reliability performance enhancement of gate stack graphene nanoribbon field effect transistor

by Anshul, Chaujar, Rishu
Published in Microelectronics and reliability (01.10.2025)

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Reliability of discrete SiC MOSFETs under severe temperature-shock and power cycling tests

by Heimler, Patrick, Richter, Sandro, Lutz, Josef, Basler, Thomas
Published in Microelectronics and reliability (01.10.2025)

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Influence of die and lid shapes on void formation in solder thermal interface materials

by Aman, Nurul Ashikin Mohd Nazrul, Abdullah, Mohd Zulkifly, Keat, Loh Wei, Keang, Ooi Chun
Published in Microelectronics and reliability (01.10.2025)

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Toward robust structure function-based thermal analysis: Quantitative metrics for semiconductor packaging evaluation

by Song, Wonbin, Lee, Guesuk, Youn, Byeng D.
Published in Microelectronics and reliability (01.10.2025)

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Degradation of high reliability lead-free solder joints under harsh thermal cycling test

by Yeom, Jeyun, Elsener, Hans Rudolf, Burgdorf, Tobias, Bischoff, Regina, Jeurgens, Lars P.H., Janczak-Rusch, Jolanta
Published in Microelectronics and reliability (01.10.2025)

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