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Self-healing behaviors of metallized high-temperature dielectric films for capacitor applications
Zhu, Jiafeng, Tong, Hui, Cao, Shimo, Luo, Jinpeng, Liu, Xuepeng, Xu, Ju, Oleksandr, Moliar, Peng, Wenfei
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Published in Microelectronics and reliability (01.05.2023)
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Low-temperature low-pressure die attach with hybrid silver particle paste
Suganuma, K., Sakamoto, S., Kagami, N., Wakuda, D., Kim, K.-S., Nogi, M.
Published in Microelectronics and reliability (01.02.2012)
Published in Microelectronics and reliability (01.02.2012)
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Failure mechanism and life estimate of metallized film capacitor under high temperature and humidity
Tai, Yunxiao, Chen, Pengqi, Jian, Yang, Fang, Qingqing, Xu, Dang, Cheng, Jigui
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Published in Microelectronics and reliability (01.10.2022)
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Impact of interface trap charges on electrical performance characteristics of a source pocket engineered Ge/Si heterojunction vertical TFET with HfO2/Al2O3 laterally stacked gate oxide
Tripathy, Manas Ranjan, Samad, A., Singh, Ashish Kumar, Singh, Prince Kumar, Baral, Kamalaksha, Mishra, Ashwini Kumar, Jit, Satyabrata
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Published in Microelectronics and reliability (01.04.2021)
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A knowledge-constrained CNN-BiLSTM model for lithium-ion batteries state-of-charge estimation
Yan, Bei, Zheng, Wenjian, Tang, Diyin, LaiLi, Yuanjun, Xing, Yalan
Published in Microelectronics and reliability (01.11.2023)
Published in Microelectronics and reliability (01.11.2023)
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Ionizing radiation hardness tests of GaN HEMTs for harsh environments
Vilas Bôas, Alexis C., de Melo, M.A.A., Santos, R.B.B., Giacomini, R., Medina, N.H., Seixas, L.E., Finco, S., Palomo, F.R., Romero-Maestre, A., Guazzelli, Marcilei A.
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Published in Microelectronics and reliability (01.01.2021)
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Effect of Creep, Fatigue and Random Vibration on the Integrity of Solder Joints in BGA Package
Depiver, Joshua A., Mallik, Sabuj, Amalu, Emeka H.
Published in Microelectronics and reliability (01.06.2024)
Published in Microelectronics and reliability (01.06.2024)
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Physics of failure based lifetime modelling for sintered silver die attach in power electronics: Accelerated stress testing by isothermal bending and thermal shock in comparison
Heilmann, Jens, Wunderle, Bernhard, Zschenderlein, Uwe, Wille, Catharina, Pressel, Klaus
Published in Microelectronics and reliability (01.06.2023)
Published in Microelectronics and reliability (01.06.2023)
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Effect of temperature on the low cycle fatigue properties of BGA solder joints
Wei, Xin, Alahmer, Ali, Ali, Heneen, Tahat, Sufyan, Vyas, Palash Pranav, Hamasha, Sa’d
Published in Microelectronics and reliability (01.07.2023)
Published in Microelectronics and reliability (01.07.2023)
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Metallized film capacitors used for EMI filtering: A reliability review
Valentine, Nathan, Azarian, Michael H., Pecht, Michael
Published in Microelectronics and reliability (01.01.2019)
Published in Microelectronics and reliability (01.01.2019)
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Ultrasonic monitoring performance degradation of lithium ion battery
Kim, Jae-Yeon, Jo, Jang-Hun, Byeon, Jai-Won
Published in Microelectronics and reliability (01.11.2020)
Published in Microelectronics and reliability (01.11.2020)
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Research progress of hybrid bonding technology for three-dimensional integration
Zhou, Anqi, Zhang, Yu, Ding, Fei, Lian, Ziqi, Jin, Renxi, Yang, Yudong, Wang, Qidong, Cao, Liqiang
Published in Microelectronics and reliability (01.04.2024)
Published in Microelectronics and reliability (01.04.2024)
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Time dependent dielectric breakdown physics – Models revisited
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