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Thermal and mechanical reliability of thermal through-silicon vias in three-dimensional integrated circuits
Qu, Chenlei, Dai, Ruoyu, Zheng, Jieqing, Hu, Yusheng, Zhang, Jinhao
Published in Microelectronics and reliability (01.04.2023)
Published in Microelectronics and reliability (01.04.2023)
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Toward understanding the impacts of dynamic Ron on the efficiency in GaN-based AC-DC flyback converter
Chang, Chih-Yao, Hsieh, Hsing-Hua, Ho, Cheng-Tsung, Wu, Tsung-Hsiu, Tsou, Ming-Chang, Hsiung, Chih-Wen, Chuang, Ming-Nan, Wu, Tian-Li
Published in Microelectronics and reliability (01.05.2025)
Published in Microelectronics and reliability (01.05.2025)
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Thermal ageing monitoring in Cu Al intermetallic joints through electrical resistance drift: Comparative study of lifetime potential in pure and alloyed copper wires
Carluccio, R., Mancaleoni, A., Losacco, G., Villa, R., Serafini, A., Guarino, L., Dellasega, D.
Published in Microelectronics and reliability (01.05.2025)
Published in Microelectronics and reliability (01.05.2025)
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Failure analysis and reliability assessment of gold-plated fuzz buttons in elevated temperature
Zhang, L., Wang, S., Chen, X., Guo, J., Xu, L., Ling, S., Zhang, X.
Published in Microelectronics and reliability (01.05.2025)
Published in Microelectronics and reliability (01.05.2025)
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Investigation of the long-term dynamic RDS(on) variation and dynamic high temperature operating life test robustness of Schottky gate and ohmic gate GaN HEMT with comparable stress conditions
Rauf, Fawad, Tayyab, Muhammad Farhan, Mouhoubi, Samir, Heldwein, Marcelo Lobo, Curatola, Gilberto
Published in Microelectronics and reliability (01.05.2025)
Published in Microelectronics and reliability (01.05.2025)
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Understanding improved pitting corrosion resistance under high temperature application leading to a newly developed palladium coated copper wire
Araki, Noritoshi, Eto, Motoki, Azuma, Shinya, Klengel, Robert, Klengel, Sandy, Yamada, Takashi
Published in Microelectronics and reliability (01.05.2025)
Published in Microelectronics and reliability (01.05.2025)
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Oxidation and wetting characteristics of lead-free Sn-0.7Cu solder alloys with the addition of Fe and Bi
Jaffery, Syed Hassan Abbas, Sabri, Mohd Faizul Mohd, Rozali, Shaifulazuar, Hasan, Syed Waqar, Mahdavifard, Mohammad Hossein, AL-Zubiady, Dhafer Abdul-ameer Shnawah, Ravuri, Balaji Rao
Published in Microelectronics and reliability (01.12.2022)
Published in Microelectronics and reliability (01.12.2022)
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Remaining useful life prediction for lithium-ion batteries based on an integrated health indicator
Sun, Yongquan, Hao, Xueling, Pecht, Michael, Zhou, Yapeng
Published in Microelectronics and reliability (01.09.2018)
Published in Microelectronics and reliability (01.09.2018)
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Finite element analysis of 2.5D packaging processes based on multi-physics field coupling for predicting the reliability of IC components
Li, Wenqian, Wang, Xinda, Zheng, Ruiqian, Zhao, Xiaohui, Zheng, Hao, Zhao, Zhiyan, Cheng, Mengxuan, Jiang, Yong, Jia, Yuxi
Published in Microelectronics and reliability (01.12.2024)
Published in Microelectronics and reliability (01.12.2024)
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Preliminary 2D elastoplastic modeling of gate cracking in SiC MOSFETs under short-circuit conditions across a wide temperature-range using rankine's damage energetic approach
Shqair, Mustafa, Sarraute, Emmanuel, Richardeau, Frédéric
Published in Microelectronics and reliability (01.07.2025)
Published in Microelectronics and reliability (01.07.2025)
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HTRB effects on threshold instability of 4H-SiC PowerMOSFET with carrots defects
Anoldo, L., Tosto, G., Dahrouch, Z., Bevilacqua, S., Schroer, E., Patanè, S., Russo, A.
Published in Microelectronics and reliability (01.07.2025)
Published in Microelectronics and reliability (01.07.2025)
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New methodology for optimal preconditioning of GaN HEMT devices
Alam, Maroun, Rustichelli, Valeria, Banc, Christophe, Pieprzyk, Jean-François, Perrotin, Olivier, Ceccarelli, Romain, Trémouilles, David, Matmat, Mohamed, Coccetti, Fabio
Published in Microelectronics and reliability (01.07.2025)
Published in Microelectronics and reliability (01.07.2025)
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